Footprints
1,657 footprints matching “pad”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
MountingHole_5.5mm_Pad_Via
MountingHole
Mounting Hole 5.5mm, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 11.5×11.5
- Boards
- 3
MountingHole_5mm_Pad_TopOnly
MountingHole
Mounting Hole 5mm, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 10.5×10.5
- Boards
- 3
MountingHole_6.4mm_M6_Pad
MountingHole
Mounting Hole 6.4mm, M6, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 13.3×13.3
- Boards
- 3
MountingHole_8.4mm_M8_Pad_Via
MountingHole
Mounting Hole 8.4mm, M8, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 17.3×17.3
- Boards
- 3
Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf
- Pads
- 6
- SMD
- 3.0×3.5
- Boards
- 3
Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 2.9×3.9
- Boards
- 3
Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 3.4×3.4
- Boards
- 3
Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 9
- SMD
- 3.5×3.5
- Boards
- 3
Xilinx_CSG324
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 3
Xilinx_FGG484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- 3
WQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm
Package_DFN_QFN
QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf)
- Pads
- 33
- SMD
- 5.9×5.9
- Boards
- 3
CERDIP-16_W7.62mm_SideBrazed_LongPads
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 10.5×20.8
- Boards
- 3
CERDIP-28_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- 3
DIP-12_W7.62mm_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 12
- THT
- 10.5×15.7
- Boards
- 3
DIP-4_W10.16mm_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 4
- THT
- 13.1×5.6
- Boards
- 3
DIP-4_W7.62mm_Socket_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 4
- THT
- 10.7×5.7
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
Infineon_PG-DSO-12-9
Package_SO
Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/)
- Pads
- 13
- SMD
- 12.1×8.6
- Boards
- 3
TO-92_Inline_W4.0mm_Horizontal_FlatSideDown
Package_TO_SOT_THT
TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.1×10.1
- Boards
- 3
TerminalBlock_4Ucon_1x04_P3.50mm_Vertical
TerminalBlock_4Ucon
Terminal Block 4Ucon ItemNo. 10695, vertical (cable from top), 4 pins, pitch 3.5mm, size 15x8.3mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.4uconnector.com/online/object/4udrawing/10695.pdf
- Pads
- 4
- THT
- 16.0×9.3
- Boards
- 3
TerminalBlock_4Ucon_1x12_P3.50mm_Horizontal
TerminalBlock_4Ucon
Terminal Block 4Ucon ItemNo. 10689, 12 pins, pitch 3.5mm, size 42.7x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/10689.pdf
- Pads
- 12
- THT
- 43.7×8.0
- Boards
- 3
Altech_AK100_1x03_P5.00mm
TerminalBlock_Altech
Terminal block Altech AK100, 3 pins, pitch 5mm, size 15x9mm, drill diameter 1.3mm, pad diameter 3mm, https://www.altechcorp.com/PDFS/PCBMETRC.PDF#page=3
- Pads
- 3
- THT
- 16.0×10.0
- Boards
- 3
TerminalBlock_MetzConnect_360271_1x01_Horizontal_ScrewM3.0_Boxed
TerminalBlock_MetzConnect
single screw terminal block Metz Connect 360271, block size 9x7.3mm, drill diameter 1.5mm, pad diameter 3mm, https://www.metz-connect.com/media/file/8a8a80ea6e17c2e6016e3b8ef7cd2d65.de.0/product_summary_u_contact_de_en_fr.pdf
- Pads
- 1
- THT
- 10.0×8.3
- Boards
- 3