Footprints

456 footprints matching “DC”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

456 footprints · page 19 of 19

Matched by name and keywords. Search by meaning instead

Converter_DCDC_Murata_MGJ2DxxxxxxSC_THT

FP—

muratovas-MAS_Package_nostd

Murata MGJ2DxxxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 2W, SIP package style, https://power.murata.com/data/power/ncl/kdc_mgj2.pdf

Pads: 5
THT: 20.0×10.3
Boards: —

Broadcom_AFBR-16xxZ_Tilted

FP3D

OptoDevice

Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN

Pads: 6
THT: 19.8×12.8
Boards: —

Broadcom_APDS-9160-003

FP—

OptoDevice

Broadcom DFN, 8 Pin (https://docs.broadcom.com/docs/APDS-9160-003-DS)

Pads: 8
SMD: 3.1×2.6
Boards: —

Broadcom_APDS-9301

FP—

OptoDevice

ambient light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN

Pads: 6
SMD: 3.1×3.8
Boards: —

Broadcom_LGA-8_2x2mm_P0.53mm

FP—

OptoDevice

Broadcom LGA, 8 Pin (https://docs.broadcom.com/docs/AV02-4755EN)

Pads: 8
SMD: 2.6×2.5
Boards: —

Broadcom_LGA-8_2x2mm_P0.5mm

FP—

OptoDevice

Broadcom LGA, 8 Pin (https://docs.broadcom.com/doc/APDS-9251-001-DS#page=19)

Pads: 8
SMD: 2.6×2.5
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

Texas_RDX0007A_QFN-FCMOD-7-3.3x4mm-P0.5mm_4EP

FP—

Package_DFN_QFN

surface-mount, Texas Instruments, power, DC/DC, https://www.ti.com/lit/ml/mpqf721/mpqf721.pdf

Pads: 7
SMD: 4.6×4.8
Boards: —

UDC-QFN-20-4EP_3x4mm_P0.5mm_EP0.41x0.25mm

FP—

Package_DFN_QFN

UDC QFN, 20 Pin, Exposed Pad Variation AB (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081536_B_UDC20(AB).pdf), modifed from generated QFN-20-1EP_3x4mm_P0.5

Pads: 24
SMD: 4.3×5.3
Boards: —

TSOP-I-48_16.4x12mm_P0.5mm

FP3D

Package_SO

TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DC)

Pads: 48
SMD: 19.5×12.5
Boards: —

TSSOP-32_6.1x11mm_P0.65mm

FP3D

Package_SO

TSSOP, 32 Pin (JEDEC MO-153 Var DC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 32
SMD: 9.4×11.5
Boards: —

Relay_Tyco_V23072_Sealed

FP—

Relay_THT

Tyco Electronics Mini Relay K (Sealed Version), length 16.9mm, width 14.7mm, height 19.2mm, drill hole 1.30mm ( https://www.electrokit.com/upload/product/41019/41019252/V23072.pdf )

Pads: 7
THT: 15.8×18.0
Boards: —