Footprints
76 footprints matching “CASE”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-64_7x7mm_P0.4mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation ABD, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfpsu/su_64_1.pdf)
- Pads
- 64
- SMD
- 10.3×10.3
- Boards
- 1
Mini-Circuits_HF1139_LandPatternPL-230
RF_Mini-Circuits
Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-230, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf)
- Pads
- 8
- SMD
- 14.2×19.3
- Boards
- 1
Mini-Circuits_TTT167
RF_Mini-Circuits
Footprint for Mini-Circuits case TTT167 (https://ww2.minicircuits.com/case_style/TTT167.pdf)
- Pads
- 6
- SMD
- 14.2×11.0
- Boards
- 1
ON SEMI SOIC-14 CASE 751A-03
celestial-altium-Leaded_SOIC
SOIC-14 CASE 751A-03, 14-Leads, Body 8.75x4.0mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 14
- SMD
- 7.0×9.0
- Boards
- —
ONSEMI - SOIC8 CASE 751EB-A
celestial-altium-Leaded_SOIC
SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 8
- SMD
- 7.8×5.5
- Boards
- —
ONSEMI TSOT-5 CASE483P
celestial-altium-Leaded_SOT_23
SOT23, 5-Leads, Body 3.00x2.75mm, Pitch 0.95mm
- Pads
- 5
- SMD
- 4.0×3.6
- Boards
- —
ONSEMI DFN-10 3X3 CASE 485P
celestial-altium-Leadless_DFN
DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm
- Pads
- 11
- SMD
- 3.8×3.6
- Boards
- —
ONSEMI XDFN6 1.2x1.2 0.40P CASE 711AT C
celestial-altium-Leadless_DFN
XDFN6, 6-Leads, Body 1.20x1.20mm, Pitch 0.40mm, Thermal Pad 0.94x0.22mm
- Pads
- 7
- SMD
- 1.8×1.6
- Boards
- —
ONSEMI QFN15 4X4 CASE 485FN B
celestial-altium-Leadless_QFN
QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, IPC Medium Density
- Pads
- 15
- SMD
- 5.0×5.0
- Boards
- —
Diode_Bridge_15.7x15.7x6.3mm_P10.8mm
Diode_THT
Single phase bridge rectifier case 15.7x15.7
- Pads
- 4
- THT
- 16.3×16.2
- Boards
- —
Diode_Bridge_16.7x16.7x6.3mm_P10.8mm
Diode_THT
Single phase bridge rectifier case 16.7x16.7
- Pads
- 4
- THT
- 17.3×17.2
- Boards
- —
Diode_Bridge_19.0x19.0x6.8mm_P12.7mm
Diode_THT
Single phase bridge rectifier case 19x19mm, pitch 12.7mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf
- Pads
- 4
- THT
- 19.5×19.5
- Boards
- —
Diode_Bridge_28.6x28.6x7.3mm_P18.0mm_P11.6mm
Diode_THT
Single phase bridge rectifier case 28.6x28.6mm, pitch 18.0mm & 11.6mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/kbpc1500fw.pdf
- Pads
- 4
- THT
- 29.6×29.6
- Boards
- —
Diode_Bridge_GeneSiC_KBPC_T
Diode_THT
Single phase, Bridge rectifier, 28.55x28.55mm, case KBPC_T(FP), https://www.diodemodule.com/bridge-rectifier/kbpc/kbpc1501t.pdf
- Pads
- 4
- THT
- 29.1×29.1
- Boards
- —
Diode_Bridge_Vishay_KBPC6
Diode_THT
Single phase bridge rectifier case KBPC6, see http://www.vishay.com/docs/93585/vs-kbpc1series.pdf
- Pads
- 4
- THT
- 15.8×15.8
- Boards
- —
DFN-6-1EP_3x3mm_P0.95mm_EP1.35x2.15mm
gekkio-Gekkio_Package_DFN_QFN
DFN6 3*3 MM, 0.95 PITCH; CASE 506AX (see ON Semiconductor 506AX.PDF)
- Pads
- 7
- SMD
- 3.8×3.7
- Boards
- —
C_CASE-A-3216-18(mm)
jlcpcb-JLCPCB
Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator
- Pads
- 2
- SMD
- 4.6×2.1
- Boards
- —
C_CASE-B-3528-21(mm)
jlcpcb-JLCPCB
Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator
- Pads
- 2
- SMD
- 4.9×3.3
- Boards
- —
TQFP-128_14x14mm_P0.4mm_PAD
muratovas-MAS_Package_std
TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF)
- Pads
- 129
- SMD
- 16.9×16.9
- Boards
- —
NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm
Package_BGA
NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf
- Pads
- 98
- SMD
- 9.0×9.0
- Boards
- —
NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm
Package_BGA
NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf
- Pads
- 59
- SMD
- 6.0×6.0
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —