Footprints
2,819 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
CERDIP-14_W7.62mm_SideBrazed
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 9.7×19.6
- Boards
- 2
CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 10.7×19.7
- Boards
- 2
DIP-14_W10.16mm_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 14
- THT
- 13.1×18.3
- Boards
- 2
DIP-14_W8.89mm_SMDSocket_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 14
- SMD
- 12.5×18.4
- Boards
- 2
DIP-24_W10.16mm_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 24
- THT
- 13.1×31.0
- Boards
- 2
DIP-28_W7.62mm_SMDSocket_SmallPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 28
- SMD
- 10.7×36.2
- Boards
- 2
DIP-64_W22.86mm_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads
- Pads
- 64
- THT
- 25.8×81.8
- Boards
- 2
DIP-64_W25.4mm
Package_DIP
64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)
- Pads
- 64
- THT
- 27.5×81.8
- Boards
- 2
DIP-64_W25.4mm_Socket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads
- Pads
- 64
- THT
- 28.4×81.9
- Boards
- 2
DIP-8-16_W7.62mm
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 8
- THT
- 9.7×20.8
- Boards
- 2
PowerIntegrations_SMD-8B
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- 2
SMDIP-8_W11.48mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 8
- SMD
- 14.0×10.7
- Boards
- 2
SMDIP-8_W9.53mm_Clearance8mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 8
- SMD
- 11.5×10.7
- Boards
- 2
VLGA-4_2x2.5mm_P1.65mm
Package_LGA
VLGA, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf#page=15)
- Pads
- 4
- SMD
- 2.5×3.0
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
SSO-6_6.8x4.6mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 11.2×5.1
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
HUSON-3-1EP_2x2mm_P1.3mm_EP1.1x1.6mm
Package_SON
HUSON, 3 Pin, SOT1061 (Ref: https://assets.nexperia.com/documents/data-sheet/PMEG2020CPA.pdf)
- Pads
- 3
- SMD
- 2.6×2.5
- Boards
- 2
Texas_S-PVSON-N8_ThermalVias
Package_SON
8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf
- Pads
- 9
- SMD
- 4.2×3.6
- Boards
- 2
VSON-14-1EP_3x4.45mm_P0.65mm_EP1.6x4.2mm_ThermalVias
Package_SON
VSON, 14 Pin (https://www.ti.com/lit/ds/symlink/lp8868x-q1.pdf#page=45)
- Pads
- 15
- SMD
- 4.3×5.0
- Boards
- 2
VSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/thvd1450.pdf#page=37)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
WSON-10-1EP_4x3mm_P0.5mm_EP2.2x2mm
Package_SON
10-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch (http://www.ti.com/lit/ds/symlink/lm4990.pdf)
- Pads
- 11
- SMD
- 4.5×3.5
- Boards
- 2