Footprints

3,487 footprints matching “4mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

3,487 footprints · page 29 of 146

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MountingHole_8.4mm_M8_Pad

FP—

MountingHole

Mounting Hole 8.4mm, M8, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 17.3×17.3
Boards: 4

Micron_FBGA-96_9x14mm_Layout9x16_P0.8mm

FP—

Package_BGA

FBGA-96, 9.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26

Pads: 96
SMD: 11.0×16.0
Boards: 4

DFN-16-1EP_3x4mm_P0.45mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf)

Pads: 17
SMD: 4.1×4.6
Boards: 4

DFN-16-1EP_4x5mm_P0.5mm_EP2.44x4.34mm

FP3D

Package_DFN_QFN

DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf)

Pads: 17
SMD: 5.0×5.6
Boards: 4

DFN-8-1EP_6x5mm_P1.27mm_EP4x4mm

FP—

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download)

Pads: 9
SMD: 7.4×5.7
Boards: 4

QFN-16-1EP_4x4mm_P0.65mm_EP2.15x2.15mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: 4

QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)

Pads: 17
SMD: 5.2×5.2
Boards: 4

QFN-20-1EP_3x4mm_P0.5mm_EP1.65x2.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)

Pads: 21
SMD: 4.3×5.3
Boards: 4

QFN-24-1EP_4x4mm_P0.5mm_EP2.65x2.65mm

FP—

Package_DFN_QFN

QFN, 24 Pin (http://www.cypress.com/file/46236/download)

Pads: 25
SMD: 5.3×5.3
Boards: 4

QFN-24-1EP_4x4mm_P0.5mm_EP2.8x2.8mm

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/hmc431.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 4

QFN-24-1EP_4x4mm_P0.5mm_EP2.8x2.8mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/hmc431.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 4

QFN-28-1EP_4x4mm_P0.4mm_EP2.4x2.4mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280)

Pads: 29
SMD: 5.2×5.2
Boards: 4

QFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm

FP—

Package_DFN_QFN

QFN, 40 Pin (http://www.issi.com/WW/pdf/31FL3736.pdf#page=28)

Pads: 41
SMD: 6.3×6.3
Boards: 4

TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35)

Pads: 9
SMD: 4.2×2.5
Boards: 4

Texas_RGE0024H_VQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

Texas RGE0024H VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=40)

Pads: 25
SMD: 5.3×5.3
Boards: 4

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads: 21
SMD: 4.2×4.2
Boards: 4

WQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29)

Pads: 21
SMD: 4.3×4.3
Boards: 4

CERDIP-8_W7.62mm_SideBrazed

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 9.7×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.5×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 4

DIP-10_W7.62mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 10
THT: 10.5×13.2
Boards: 4

DIP-12_W7.62mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 12
THT: 9.7×15.7
Boards: 4

DIP-48_W15.24mm_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 48
THT: 18.1×61.5
Boards: 4

Vishay_HVM-DIP-3_W7.62mm

FP3D

Package_DIP

3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf

Pads: 3
THT: 9.9×5.5
Boards: 4