Footprints

857 footprints matching “x4”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

857 footprints · page 29 of 36

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LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm_ThermalVias

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm_ThermalVias

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-VQ-24-1EP_4x4mm_P0.5mm_EP2.642x2.642mm

FP—

Package_CSP

LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf)

Pads: 25
SMD: 5.1×5.1
Boards: —

Macronix_WLCSP-12_2.02x2.09mm_Layout4x4_P0.5mm

FP—

Package_CSP

WLCSP-12, 2.02x2.09mm, 12 Ball, 4x4 Layout, 0.5mm Pitch, https://www.macronix.com/Lists/Datasheet/Attachments/8909/MX25U3232F,%201.8V,%2032Mb,%20v1.2.pdf#page=93

Pads: 12
SMD: 4.0×4.1
Boards: —

ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm

FP—

Package_CSP

ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf

Pads: 100
SMD: 6.4×6.5
Boards: —

ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter

FP—

Package_CSP

ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf

Pads: 100
SMD: 6.4×6.4
Boards: —

ST_WLCSP-115_3.73x4.15mm_Layout11x21_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf

Pads: 115
SMD: 5.7×6.2
Boards: —

ST_WLCSP-115_4.63x4.15mm_Layout21x11_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf

Pads: 115
SMD: 6.6×6.2
Boards: —

ST_WLCSP-132_4.57x4.37mm_Layout12x11_P0.35mm

FP—

Package_CSP

ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf

Pads: 132
SMD: 6.6×6.4
Boards: —

ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm

FP—

Package_CSP

ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf

Pads: 156
SMD: 7.0×6.6
Boards: —

ST_WLCSP-81_4.02x4.27mm_Layout9x9_P0.4mm

FP—

Package_CSP

ST WLCSP-81, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf

Pads: 81
SMD: 6.0×6.3
Boards: —

ST_WLCSP-81_4.36x4.07mm_Layout9x9_P0.4mm

FP—

Package_CSP

ST WLCSP-81, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf

Pads: 81
SMD: 6.4×6.1
Boards: —

WLCSP-12_1.403x1.555mm_Layout6x4_P0.4mm_Stagger

FP—

Package_CSP

WLCSP-12, staggered array, 1.403x1.555mm, 12 Ball, X-staggered 6x4 Layout, 0.4mm Pitch, http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208

Pads: 12
SMD: 3.4×3.6
Boards: —

WLCSP-16_1.409x1.409mm_Layout4x4_P0.35mm

FP—

Package_CSP

WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads: 16
SMD: 3.4×3.4
Boards: —

WLCSP-16_2.225x2.17mm_Layout4x4_P0.5mm

FP—

Package_CSP

WLCSP-16 2.225x2.17mm, 2.225x2.17mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf

Pads: 16
SMD: 4.2×4.2
Boards: —

WLCSP-16_4x4_B2.17x2.32mm_P0.5mm

FP—

Package_CSP

WLCSP-16, http://www.nxp.com/documents/data_sheet/LPC1102_1104.pdf, http://www.nxp.com/assets/documents/data/en/application-notes/AN3846.pdf

Pads: 16
SMD: 3.9×3.9
Boards: —

WLCSP-20_1.994x1.609mm_Layout5x4_P0.4mm

FP—

Package_CSP

WLCSP-20, https://www.nxp.com/docs/en/package-information/98ASA00676D.pdf

Pads: 20
SMD: 4.2×3.8
Boards: —

WLCSP-8_1.551x2.284mm_Layout2x4_P0.5mm

FP—

Package_CSP

WLCSP-8, 1.551x2.284mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75

Pads: 8
SMD: 3.6×4.3
Boards: —

DFN-12-1EP_4x4mm_P0.65mm_EP2.64x3.54mm

FP3D

Package_DFN_QFN

DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF)

Pads: 13
SMD: 4.8×4.7
Boards: —

DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm_ThermalVias

FP—

Package_DFN_QFN

14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)

Pads: 15
SMD: 4.4×5.0
Boards: —