Footprints

486 footprints matching “SOP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

486 footprints · page 3 of 21

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HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 25

SOP-24_7.5x15.4mm_P1.27mm

FP—

Package_SO

SOP, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14)

Pads: 24
SMD: 11.8×15.9
Boards: 25

SSOP-10_3.9x4.9mm_P1.00mm

FP3D

Package_SO

10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)

Pads: 10
SMD: 6.7×5.4
Boards: 25

TSSOP-16-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 25

SSOP-16_4.4x5.2mm_P0.65mm

FP3D

Package_SO

SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)

Pads: 16
SMD: 7.3×5.8
Boards: 22

SSOP-8_3.95x5.21x3.27mm_P1.27mm

FP3D

Package_SO

SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm

Pads: 8
SMD: 7.2×5.7
Boards: 22

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 20

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads: 57
SMD: 9.6×14.6
Boards: 16

SSOP-16_5.3x6.2mm_P0.65mm

FP3D

Package_SO

SSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14)

Pads: 16
SMD: 9.1×6.7
Boards: 15

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads: 9
SMD: 6.3×3.5
Boards: 14

SSOP-14_5.3x6.2mm_P0.65mm

FP3D

Package_SO

SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)

Pads: 14
SMD: 9.4×6.7
Boards: 14

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm

FP—

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 13

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 13

SOP-20_7.5x12.8mm_P1.27mm

FP—

Package_SO

SOP, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf)

Pads: 20
SMD: 11.6×13.3
Boards: 13

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 10

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm

FP—

Package_SO

HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20)

Pads: 17
SMD: 7.8×5.5
Boards: 10

JEITA_SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 8 Pin (JEITA/EIAJ ED-7311-19, variation 08-001-ADB, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=20)

Pads: 8
SMD: 7.3×5.4
Boards: 10

MSOP-16_3x4.039mm_P0.5mm

FP3D

Package_SO

MSOP, 16 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081669_A_MS16.pdf)

Pads: 16
SMD: 6.3×4.5
Boards: 10

QSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 24
SMD: 7.4×9.2
Boards: 10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

Diodes_PSOP-8

FP—

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 9