Footprints

72 footprints matching “Semi”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

72 footprints · page 3 of 3

Matched by name and keywords. Search by meaning instead

WURTH WE-LQSH 2010

FP—

celestial-altium-Power_Inductors

SMT Semi-Shielded High Saturation Power Inductor, body 2x1.6mm

Pads: 2
SMD: 2.8×2.2
Boards: —

WURTH WE-LQSH 2512

FP—

celestial-altium-Power_Inductors

SMT Semi-Shielded High Saturation Power Inductor, body 2.5x2mm

Pads: 2
SMD: 3.1×2.6
Boards: —

WURTH WE-LQSH 3012

FP—

celestial-altium-Power_Inductors

SMT Semi-Shielded High Saturation Power Inductor, body 3x3mm

Pads: 2
SMD: 3.6×3.4
Boards: —

WURTH WE-LQSH 4020

FP—

celestial-altium-Power_Inductors

SMT Semi-Shielded High Saturation Power Inductor, body 4x4mm

Pads: 2
SMD: 4.7×4.6
Boards: —

GAPTEC 3S7B_3U DUAL

FP—

celestial-altium-Power_Module

3W Single/Dual Output - Fixed Input - Isolated & Semi-regulated

Pads: 5
THT: 20.3×7.8
Boards: —

GAPTEC 3S7B_3U SINGLE

FP—

celestial-altium-Power_Module

3W Single/Dual Output - Fixed Input - Isolated & Semi-regulated

Pads: 4
THT: 20.3×7.8
Boards: —

ONSemi_QSE15x

FP—

OptoDevice

3 Lead Plastic Package

Pads: 3
THT: 5.8×3.0
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

pSemi_CSP-16_1.64x2.04mm_P0.4mm

FP—

Package_CSP

pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)

Pads: 16
SMD: 2.1×2.5
Boards: —

pSemi_CSP-16_1.64x2.04mm_P0.4mm_Pad0.18mm

FP—

Package_CSP

pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)

Pads: 16
SMD: 2.1×2.5
Boards: —

OnSemi_DFN-14-1EP_4x4mm_P0.5mm_EP2.7x3.4mm

FP3D

Package_DFN_QFN

OnSemi DFN, 14 Pin (https://www.onsemi.com/pub/Collateral/506CM.PDF)

Pads: 15
SMD: 5.2×4.5
Boards: —

OnSemi_DFN-8_2x2mm_P0.5mm

FP—

Package_DFN_QFN

DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF)

Pads: 8
SMD: 2.8×2.5
Boards: —

OnSemi_SIP-38-6EP-9x7mm_P0.65mm_EP1.2x1.2mm

FP3D

Package_DFN_QFN

On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19)

Pads: 44
SMD: 9.5×7.5
Boards: —

OnSemi_UDFN-8_1.2x1.8mm_P0.4mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF)

Pads: 8
SMD: 2.0×2.3
Boards: —

OnSemi_VCT-28_3.5x3.5mm_P0.4mm

FP—

Package_DFN_QFN

OnSemi VCT, 28 Pin (http://www.onsemi.com/pub/Collateral/601AE.PDF)

Pads: 28
SMD: 4.7×4.7
Boards: —

OnSemi_XDFN-10_1.35x2.2mm_P0.4mm

FP—

Package_DFN_QFN

10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf)

Pads: 10
SMD: 2.0×2.8
Boards: —

LQFP-176_20x20mm_P0.4mm

FP3D

Package_QFP

LQFP, 176 Pin (JEDEC MS-026 variation BFC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 176
SMD: 23.3×23.3
Boards: —

TQFP-176_20x20mm_P0.4mm

FP—

Package_QFP

TQFP, 176 Pin (JEDEC MS-026 variation AFC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 176
SMD: 23.3×23.3
Boards: —

TQFP-80_14x14mm_P0.65mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)

Pads: 80
SMD: 17.3×17.3
Boards: —