Footprints
655 footprints matching “we”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
L_Changjiang_FNR3015S
Inductor_SMD
Inductor, Changjiang, FNR3015S, 3.0x3.0x1.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 3.6×3.5
- Boards
- 8
L_Changjiang_FNR5045S
Inductor_SMD
Inductor, Changjiang, FNR5045S, 5.0x5.0x4.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 5.6×5.5
- Boards
- 8
Vishay_PowerPAK_SC70-6L_Single
Package_TO_SOT_SMD
Vishay PowerPAK SC70 single transistor package http://www.vishay.com/docs/70486/70486.pdf
- Pads
- 3
- SMD
- 2.7×2.6
- Boards
- 8
MonoWireless_TWE-L-WX
RF_Module
https://www.mono-wireless.com/jp/products/TWE-LITE/MW-PDS-TWELITE-JP.pdf
- Pads
- 32
- SMD
- 15.4×15.4
- Boards
- 8
L_Changjiang_FNR5020S
Inductor_SMD
Inductor, Changjiang, FNR5020S, 5.0x5.0x2.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 5.6×5.5
- Boards
- 7
R_Axial_Power_L50.0mm_W9.0mm_P55.88mm
Resistor_THT
Resistor, Axial_Power series, Box, pin pitch=55.88mm, 11W, length*width*height=50*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf
- Pads
- 2
- THT
- 58.8×9.5
- Boards
- 7
HOPERF_RFM9XW_THT
RF_Module
Low Power Long Range Transceiver Module THT-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf)
- Pads
- 16
- THT
- 16.5×16.5
- Boards
- 7
Converter_DCDC_XP_POWER-ITxxxxxS_THT
Converter_DCDC
DCDC-Converter, XP Power, IT series, 3W, 1500V isolation, SIP-9, https://www.xppower.com/portals/0/pdfs/SF_IT.pdf
- Pads
- 7
- THT
- 11.7×28.5
- Boards
- 6
L_Abracon_ASPI-0425
Inductor_SMD
Inductor, Abracon, ASPI-0425, 4.0x4.0x2.5mm, (https://abracon.com/Magnetics/new/ASPI-0425.pdf)
- Pads
- 2
- SMD
- 5.1×4.5
- Boards
- 6
L_APV_APH0420
Inductor_SMD
Inductor, APV, APH0420, 4.2x4.2x1.8mm, (http://en.apvind.com/public/upload/20240408/996aafa961154ed753e4983e7eb80fa7.pdf)
- Pads
- 2
- SMD
- 5.7×4.7
- Boards
- 6
L_Changjiang_FNR6045S
Inductor_SMD
Inductor, Changjiang, FNR6045S, 6.0x6.0x4.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 6.7×6.5
- Boards
- 6
L_Changjiang_FXL0630
Inductor_SMD
Inductor, Changjiang, FXL0630, 6.45x6.6x2.8mm, (https://www.lcsc.com/datasheet/lcsc_datasheet_2404260921_cjiang--Changjiang-Microelectronics-Tech-FXL0420-2R2-M_C167206.pdf)
- Pads
- 2
- SMD
- 8.9×7.1
- Boards
- 6
L_KOHERelec_MDA7030
Inductor_SMD
Inductor, KOHERelec, MDA7030, 7.1x6.6x2.8mm, (http://www.kohergroup.com/template/default/pdf/MDA7030.pdf)
- Pads
- 2
- SMD
- 8.5×7.1
- Boards
- 6
PowerPAK_SO-8_Dual
Package_SO
PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf)
- Pads
- 6
- SMD
- 7.1×5.5
- Boards
- 6
ST_MultiPowerSO-30
Package_SO
MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf)
- Pads
- 33
- SMD
- 20.1×17.7
- Boards
- 6
Fairchild_DualPower33-6_3x3mm
Package_SON
Fairchild Power33 MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf)
- Pads
- 6
- SMD
- 3.8×3.5
- Boards
- 6
R_Axial_Power_L20.0mm_W6.4mm_P22.40mm
Resistor_THT
Resistor, Axial_Power series, Box, pin pitch=22.4mm, 4W, length*width*height=20*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf
- Pads
- 2
- THT
- 25.3×6.9
- Boards
- 6
R_Axial_Power_L25.0mm_W6.4mm_P30.48mm
Resistor_THT
Resistor, Axial_Power series, Box, pin pitch=30.48mm, 5W, length*width*height=25*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf
- Pads
- 2
- THT
- 33.4×6.9
- Boards
- 6
Samtec_HPM-02-01-x-S_Straight_1x02_Pitch5.08mm
Connector_Samtec_HPM_THT
Through hole straight Samtec HPM power header series 11.94mm post length, 1x02, 5.08mm pitch, single row
- Pads
- 2
- THT
- 7.4×11.2
- Boards
- 5
TE_MATE-N-LOK_350211-1_1x04_P5.08mm_Vertical
Connector_TE-Connectivity
https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F350211%7FU5%7Fpdf%7FEnglish%7FENG_CD_350211_U5.pdf%7F350211-1
- Pads
- 4
- THT
- 25.9×10.2
- Boards
- 5
Converter_DCDC_XP_POWER_JTExxxxDxx_THT
Converter_DCDC
DCDC-Converter, XP POWER, Type JTE06 Series, Dual Output
- Pads
- 8
- THT
- 20.8×32.3
- Boards
- 5