Footprints
434 footprints matching “0.65”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
SolderWire-0.25sqmm_1x03_P4.2mm_D0.65mm_OD1.7mm
Connector_Wire
Soldered wire connection, for 3 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 3
- THT
- 11.6×2.8
- Boards
- 4
QFN-16-1EP_4x4mm_P0.65mm_EP2.15x2.15mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 4
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 4
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 4
Texas_B3QFN-14-1EP_5x5.5mm_P0.65mm_ThermalVia
Package_DFN_QFN
Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf
- Pads
- 15
- SMD
- 5.9×6.0
- Boards
- 4
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm
Package_SO
HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 21
- SMD
- 7.7×7.0
- Boards
- 4
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm
Package_SO
HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
SolderWire-0.25sqmm_1x01_D0.65mm_OD2mm
Connector_Wire
Soldered wire connection, for a single 0.25 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 2mm, size source Multi-Contact FLEXI-2V 0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 3.5×3.0
- Boards
- 3
SolderWire-0.25sqmm_1x04_P4.2mm_D0.65mm_OD1.7mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 15.8×13.2
- Boards
- 3
UFBGA-201_10x10mm_Layout15x15_P0.65mm
Package_BGA
UFBGA-201, 10.0x10.0mm, 201 Ball, 15x15 Layout, 0.65mm Pitch, http://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=166
- Pads
- 201
- SMD
- 12.0×12.0
- Boards
- 3
MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm
Package_DFN_QFN
8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)
- Pads
- 9
- SMD
- 3.7×3.5
- Boards
- 3
QFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 16 Pin (https://www.allegromicro.com/~/media/Files/Datasheets/A4403-Datasheet.ashx)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 3
QFN-24-1EP_5x5mm_P0.65mm_EP3.2x3.2mm
Package_DFN_QFN
QFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/(UH24)%20QFN%2005-08-1747%20Rev%20A.pdf)
- Pads
- 25
- SMD
- 6.3×6.3
- Boards
- 3
Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm
Package_DFN_QFN
Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)
- Pads
- 21
- SMD
- 6.3×6.3
- Boards
- 3
Texas_RTY_WQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm_ThermalVias
Package_DFN_QFN
Texas RTY WQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=36 MO-220 variation VGGC)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 3
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm
Package_SO
HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm
Package_SO
HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm_ThermalVias
Package_SO
HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3