Footprints
323 footprints matching “Jedec”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSSOP-30_4.4x7.8mm_P0.5mm
Package_SO
TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 30
- SMD
- 7.7×8.3
- Boards
- 3
SC-70-8
Package_TO_SOT_SMD
SOT, 8 Pin (JEDEC MO-203, variant BA, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-sc-70/sot_8_05-08-1639.pdf)
- Pads
- 8
- SMD
- 2.9×2.2
- Boards
- 3
Texas_R-PDSO-G5_DCK-5
Package_TO_SOT_SMD
DCK R-PDSO-G5, JEDEC MO-203C Var AA, https://www.ti.com/lit/ds/symlink/tmp20.pdf#page=23
- Pads
- 5
- SMD
- 3.6×2.5
- Boards
- 3
Texas_R-PDSO-N6_DRL-6
Package_TO_SOT_SMD
R-PDSO-N6, DRL, similar to JEDEC MO-293B Var UAAD (but not the same), https://www.ti.com/lit/ml/mpds159i/mpds159i.pdf
- Pads
- 6
- SMD
- 2.7×2.1
- Boards
- 3
WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm
Package_DFN_QFN
WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)
- Pads
- 29
- SMD
- 5.3×5.3
- Boards
- 2
CERDIP-14_W7.62mm_SideBrazed
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 9.7×19.6
- Boards
- 2
CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 10.7×19.7
- Boards
- 2
TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 2
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×16.6
- Boards
- 2
TSSOP-20_4.4x5mm_P0.5mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×5.5
- Boards
- 2
TSSOP-24_4.4x5mm_P0.4mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×5.5
- Boards
- 2
TSSOP-28_6.1x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 9.4×10.2
- Boards
- 2
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var AET Pkg.Code U28E-4 https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- 2
TSSOP-56_6.1x14mm_P0.5mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 9.4×14.5
- Boards
- 2
Texas_R-PDSO-N5_DRL-5
Package_TO_SOT_SMD
R-PDSO-N5, DRL, JEDEC MO-293B Var UAAD-1, https://www.ti.com/lit/ml/mpds158g/mpds158g.pdf
- Pads
- 5
- SMD
- 2.7×2.1
- Boards
- 2
SODIMM-200_1.8V_Card_edge
Connector_PCBEdge
SODIMM 200-pins edge connector, Jedec MO-224 Variation AB compliant (1.8V DDR2 SDRAM), 0.6mm pitch, https://www.jst-mfg.com/product/pdf/eng/eDM-200P.pdf
- Pads
- 200
- Mount
- 68.6×27.9
- Boards
- 1
SODIMM-200_2.5V_Card_edge
Connector_PCBEdge
SODIMM 200-pins edge connector, Jedec MO-224 Variation AA compliant (2.5V DDR SDRAM), 0.6mm pitch, https://www.jst-mfg.com/product/pdf/eng/eDM-200P.pdf
- Pads
- 200
- Mount
- 68.6×27.9
- Boards
- 1
ST_D_SMC
Diode_SMD
STMicroelectronics SMC (JEDEC DO-214-D, variant AB), https://www.st.com/resource/en/datasheet/sm15t36a.pdf#page=7
- Pads
- 2
- SMD
- 8.8×6.4
- Boards
- 1
VQFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
VQFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm_ThermalVias
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 1
CERDIP-14_W7.62mm_SideBrazed_LongPads
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 10.5×19.6
- Boards
- 1
CERDIP-16_W7.62mm_SideBrazed
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 9.7×20.8
- Boards
- 1
CERDIP-16_W7.62mm_SideBrazed_Socket
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- 1