Footprints
497 footprints matching “SOP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
STC_SOP-16_3.9x9.9mm_P1.27mm
Package_SO
STC SOP, 16 Pin (https://www.stcmicro.com/datasheet/STC15F2K60S2-en.pdf#page=156)
- Pads
- 16
- SMD
- 7.4×10.4
- Boards
- 9
TSOP-II-32_21.0x10.2mm_P1.27mm
Package_SO
32-lead plastic TSOP; Type II
- Pads
- 32
- SMD
- 13.4×21.0
- Boards
- 9
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 8
MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm
Package_SO
MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 8
SOIC-8_5.3x6.2mm_P1.27mm
Package_SO
SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)
- Pads
- 8
- SMD
- 9.4×6.7
- Boards
- 8
SOP-28_8.4x18.16mm_P1.27mm
Package_SO
SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)
- Pads
- 28
- SMD
- 13.9×18.7
- Boards
- 8
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8
TSSOP-38_4.4x9.7mm_P0.5mm
Package_SO
TSSOP, 38 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 38
- SMD
- 7.7×10.2
- Boards
- 8
ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 7
HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
Package_SO
HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 7
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 7
TSSOP-24_6.1x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 9.4×8.3
- Boards
- 7
Vishay_MINIMOLD-3Pin
OptoDevice
IR Receiver Vishay TSOP-xxxx, MINIMOLD package, see https://www.vishay.com/docs/82742/tsop331.pdf
- Pads
- 3
- THT
- 7.4×5.5
- Boards
- 6
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 6
TSOP-I-28_11.8x8mm_P0.55mm
Package_SO
TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)
- Pads
- 28
- SMD
- 14.9×8.7
- Boards
- 6
Vishay_CAST-3Pin
OptoDevice
IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82493/tsop311.pdf
- Pads
- 3
- THT
- 10.5×5.7
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 5
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm
Package_SO
HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 21
- SMD
- 7.7×7.0
- Boards
- 4
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm
Package_SO
HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 4
QSOP-28_3.9x9.9mm_P0.635mm
Package_SO
QSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 28
- SMD
- 7.4×10.4
- Boards
- 4