Footprints
1,133 footprints matching “1.0”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
JST_SH_SM06B-SRSS-TB_1x06-1MP_P1.00mm_Horizontal
muratovas-MAS_Package_std
JST SH series connector, SM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator
- Pads
- 7
- SMD
- 9.8×6.6
- Boards
- —
JST_SH_SM08B-SRSS-TB_1x08-1MP_P1.00mm_Horizontal
muratovas-MAS_Package_std
JST SH series connector, SM08B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator
- Pads
- 9
- SMD
- 11.8×6.6
- Boards
- —
JST_SH_SM09B-SRSS-TB_1x09-1MP_P1.00mm_Horizontal
muratovas-MAS_Package_std
JST SH series connector, SM09B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator
- Pads
- 10
- SMD
- 12.8×6.6
- Boards
- —
T-PBGA-24_6.0x8.0mm_Layout5x5_P1.0mm
muratovas-MAS_Package_std
- Pads
- 24
- SMD
- 7.0×9.0
- Boards
- —
NetTie-3_THT_Pad1.0mm
NetTie
Net tie, 3 pin, 1.0mm round THT pads
- Pads
- 3
- THT
- through_hole
- Boards
- —
Analog_BGA-165_11.9x16mm_Layout11x15_P1.0mm
Package_BGA
Analog BGA-165 (Reference LTC DWG#05-08-1605 Rev B), 11.9x16.0mm, 165 Ball, 11x15 Layout, 1.0mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081605_b_bga165.pdf
- Pads
- 165
- SMD
- 13.9×18.0
- Boards
- —
BGA-1023_33.0x33.0mm_Layout32x32_P1.0mm
Package_BGA
BGA-1023
- Pads
- 1023
- SMD
- 35.0×35.0
- Boards
- —
BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm
Package_BGA
BGA-1156
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —
BGA-1295_37.5x37.5mm_Layout36x36_P1.0mm
Package_BGA
BGA-1295
- Pads
- 1295
- SMD
- 39.5×39.5
- Boards
- —
BGA-132_12x18mm_Layout11x17_P1.0mm
Package_BGA
BGA-132 11x17 12x18mm 1.0pitch
- Pads
- 132
- SMD
- 13.0×19.0
- Boards
- —
BGA-196_15x15mm_Layout14x14_P1.0mm
Package_BGA
BGA-196, 15.0x15.0mm, 196 Ball, 14x14 Layout, 1.0mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/VMDS-10502.pdf#page=99
- Pads
- 196
- SMD
- 17.0×17.0
- Boards
- —
BGA-24_8x8mm_Layout5x5_P1.0mm
Package_BGA
BGA-24, 8x8mm, 24 Ball, 5x5 Layout, 1.0mm Pitch, https://www.infineon.com/assets/row/public/packages/73/package_outline_download/infineon-pg-bga-24-804-spo-pdf-package-en.pdf
- Pads
- 24
- SMD
- 10.0×10.0
- Boards
- —
BGA-256_11.0x11.0mm_Layout20x20_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-256, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00348-01.pdf
- Pads
- 256
- SMD
- 13.0×13.0
- Boards
- —
BGA-324_19.0x19.0mm_Layout18x18_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00233-03.pdf
- Pads
- 324
- SMD
- 21.0×21.0
- Boards
- —
BGA-625_21.0x21.0mm_Layout25x25_P0.8mm
Package_BGA
BGA-625
- Pads
- 625
- SMD
- 23.0×23.0
- Boards
- —
BGA-672_27.0x27.0mm_Layout26x26_P1.0mm_Ball0.6mm_Pad0.5mm_NSMD
Package_BGA
Altera BGA-672, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00472-00.pdf
- Pads
- 672
- SMD
- 29.0×29.0
- Boards
- —
BGA-676_27.0x27.0mm_Layout26x26_P1.0mm_Ball0.6mm_Pad0.5mm_NSMD
Package_BGA
XILINX BGA-676, https://www.xilinx.com/support/documentation/package_specs/fg676.pdf
- Pads
- 676
- SMD
- 29.0×29.0
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm
Package_BGA
FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 1152
- SMD
- 37.0×37.0
- Boards
- —
Texas_DSBGA-6_0.704x1.054mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA0006-C01 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62800.pdf
- Pads
- 6
- SMD
- 2.7×3.1
- Boards
- —
Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf
- Pads
- 6
- SMD
- 2.8×3.0
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×18.2
- Boards
- —