Footprints
323 footprints matching “Jedec”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
CERDIP-18_W7.62mm_SideBrazed
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 9.7×23.4
- Boards
- 1
CERDIP-20_W7.62mm_SideBrazed
Package_DIP
20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 20
- THT
- 9.7×25.9
- Boards
- 1
CERDIP-20_W7.62mm_SideBrazed_LongPads
Package_DIP
20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 20
- THT
- 10.5×25.9
- Boards
- 1
CERDIP-20_W7.62mm_SideBrazed_Socket
Package_DIP
20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 20
- THT
- 10.7×26.0
- Boards
- 1
TQFP-100_12x12mm_P0.4mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation ADE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=685)
- Pads
- 100
- SMD
- 15.3×15.3
- Boards
- 1
TQFP-64_7x7mm_P0.4mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation ABD, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfpsu/su_64_1.pdf)
- Pads
- 64
- SMD
- 10.3×10.3
- Boards
- 1
SOIC-32_7.518x20.777mm_P1.27mm
Package_SO
SOIC, 32 Pin (JEDEC MO-119-B, 300 mils width, variation AC, https://www.jedec.org/system/files/docs/Mo-119b.pdf)
- Pads
- 32
- SMD
- 11.9×21.3
- Boards
- 1
SOJ-28_10.16x18.415mm_P1.27mm
Package_SO
SOJ, 28 Pin (JEDEC MS-027-A, 400 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-027a.pdf)
- Pads
- 28
- SMD
- 12.6×18.9
- Boards
- 1
TSSOP-14_4.4x3.6mm_P0.4mm
Package_SO
TSSOP, 14 Pin (JEDEC MO-194 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-194)
- Pads
- 14
- SMD
- 7.7×4.1
- Boards
- 1
TSSOP-20_4.4x5mm_P0.4mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194)
- Pads
- 20
- SMD
- 7.7×5.5
- Boards
- 1
TFBGA-126_10.5x13.5mm_Layout12x16_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 126 balls (JEDEC MO-210Q), 13.5x10.5mm, 126 Ball, 12x16 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 126
- SMD
- 12.5×15.5
- Boards
- —
TFBGA-128_11x13mm_Layout12x12_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 128 balls (JEDEC MO-210Q), 13.0x11.0mm, 128 Ball, 12x12 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 128
- SMD
- 13.0×15.0
- Boards
- —
TFBGA-136_10x14mm_Layout12x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 136 balls (JEDEC MO-210Q), 14.0x10.0mm, 136 Ball, 12x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 136
- SMD
- 12.0×16.0
- Boards
- —
TFBGA-144_10.5x14mm_Layout11x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 144 balls (JEDEC MO-210Q), 14.0x10.5mm, 144 Ball, 11x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 144
- SMD
- 12.5×16.0
- Boards
- —
TFBGA-144_10x14mm_Layout11x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 144 balls (JEDEC MO-210Q), 14.0x10.0mm, 144 Ball, 11x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 144
- SMD
- 12.0×16.0
- Boards
- —
TFBGA-144_11x14mm_Layout11x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 144 balls (JEDEC MO-210Q), 14.0x11.0mm, 144 Ball, 11x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 144
- SMD
- 13.0×16.0
- Boards
- —
TFBGA-144_13x15mm_Layout13x13_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 144 balls (JEDEC MO-210Q), 15.0x13.0mm, 144 Ball, 13x13 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 144
- SMD
- 15.0×17.0
- Boards
- —
TFBGA-195_13x15mm_Layout13x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 195 balls (JEDEC MO-210Q), 15.0x13.0mm, 195 Ball, 13x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 195
- SMD
- 15.0×17.0
- Boards
- —
TFBGA-221_13x15mm_Layout13x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 221 balls (JEDEC MO-210Q), 15.0x13.0mm, 221 Ball, 13x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 221
- SMD
- 15.0×17.0
- Boards
- —
TFBGA-252_12x18mm_Layout14x22_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 252 balls (JEDEC MO-210Q), 18.0x12.0mm, 252 Ball, 14x22 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 252
- SMD
- 14.0×20.0
- Boards
- —
TFBGA-272_14x18mm_Layout16x22_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 272 balls (JEDEC MO-210Q), 18.0x14.0mm, 272 Ball, 16x22 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 272
- SMD
- 16.0×20.0
- Boards
- —
TFBGA-316_14x18mm_Layout16x22_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 316 balls (JEDEC MO-210Q), 18.0x14.0mm, 316 Ball, 16x22 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 316
- SMD
- 16.0×20.0
- Boards
- —
TFBGA-40_8x15mm_Layout6x10_P0.8mm_Ball0.3mm_Pad0.25mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 40 balls (JEDEC MO-210Q), 15.0x8.0mm, 40 Ball, 6x10 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 40
- SMD
- 10.0×17.0
- Boards
- —
TFBGA-48_6x12mm_Layout6x8_P0.8mm_Ball0.3mm_Pad0.25mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 48 balls (JEDEC MO-210Q), 12.0x6.0mm, 48 Ball, 6x8 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 48
- SMD
- 8.0×14.0
- Boards
- —
