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Footprints

1,939 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

1,939 footprints · page 6 of 81

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DIP-16_W10.16mm

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
16
THT
12.3×20.8
Boards
10

DIP-16_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads
16
SMD
10.7×20.9
Boards
10

PLCC-28_THT-Socket

FP—

Package_LCC

PLCC, 28 pins, through hole

Pads
28
THT
19.0×19.0
Boards
10

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf)

Pads
17
SMD
7.0×5.7
Boards
10

DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm

FP3D

Package_DFN_QFN

DC6 Package; 6-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf)

Pads
7
SMD
3.1×2.6
Boards
9

Linear_DE14MA

FP—

Package_DFN_QFN

14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf)

Pads
14
SMD
4.0×4.5
Boards
9

DIP-10_W7.62mm

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
10
THT
9.7×13.2
Boards
9

DIP-4_W10.16mm

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
4
THT
12.3×5.6
Boards
9

Infineon_PG-TSNP-6-10_0.7x1.1mm_0.7x1.1mm_P0.4mm

FP—

Package_LGA

6 lead, 1.1x0.7mm body, 0.37mm height, TSNP (https://www.infineon.com/cms/en/product/packages/PG-TSNP/PG-TSNP-6-10/)

Pads
6
SMD
1.2×1.6
Boards
9

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads
128
SMD
17.3×17.3
Boards
9

Diodes_PSOP-8

FP—

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)

Pads
9
SMD
7.4×5.4
Boards
9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads
17
SMD
7.0×5.7
Boards
9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
9

TSOP-II-32_21.0x10.2mm_P1.27mm

FP3D

Package_SO

32-lead plastic TSOP; Type II

Pads
32
SMD
13.4×21.0
Boards
9

Allegro_QFN-12-10-1EP_3x3mm_P0.5mm

FP—

Sensor_Current

Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx)

Pads
10
SMD
4.2×4.3
Boards
9

DIP-42_W15.24mm

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads
42
THT
17.3×53.9
Boards
8

DIP-64_W22.86mm_Socket

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket

Pads
64
THT
25.9×81.9
Boards
8

DIP-64_W22.86mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket, LongPads

Pads
64
THT
25.9×81.9
Boards
8

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads
29
SMD
7.3×10.3
Boards
8

SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads
48
SMD
11.1×16.5
Boards
8

DIP-4_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads
4
SMD
10.7×5.7
Boards
7

DIP-48_W15.24mm_Socket_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads
48
THT
18.3×61.6
Boards
7

DIP-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads
6
THT
10.7×8.2
Boards
7

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
21
SMD
7.9×7.1
Boards
7