Footprints

497 footprints matching “sop”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

497 footprints · page 6 of 21

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TSOP-I-32_18.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD)

Pads: 32
SMD: 21.5×8.5
Boards: 3

TSOP-I-56_18.4x14mm_P0.5mm

FP3D

Package_SO

TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC)

Pads: 56
SMD: 21.5×14.5
Boards: 3

TSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm_ThermalVias

FP—

Package_SO

TSSOP, 16 Pin (Allegro A4954 https://www.allegromicro.com/-/media/Files/Datasheets/A4954-Datasheet.ashx)

Pads: 17
SMD: 7.8×5.5
Boards: 3

TSSOP-30_4.4x7.8mm_P0.5mm

FP3D

Package_SO

TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 30
SMD: 7.7×8.3
Boards: 3

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×16.6
Boards: 2

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm_ThermalVias

FP—

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 2

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads: 21
SMD: 7.7×7.0
Boards: 2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2

MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm_ThermalVias

FP3D

Package_SO

MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)

Pads: 11
SMD: 6.3×3.5
Boards: 2

MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm

FP3D

Package_SO

MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)

Pads: 17
SMD: 6.3×4.5
Boards: 2

MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)

Pads: 9
SMD: 6.2×3.5
Boards: 2

SOP-32_11.305x20.495mm_P1.27mm

FP—

Package_SO

SOP, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)

Pads: 32
SMD: 15.7×21.0
Boards: 2

SOP-8-1EP_4.57x4.57mm_P1.27mm_EP4.57x4.45mm

FP—

Package_SO

SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX112.pdf)

Pads: 9
SMD: 11.7×5.1
Boards: 2

SSOP-4_4.4x2.6mm_P1.27mm

FP—

Package_SO

SSOP, 4 Pin (https://www.vishay.com/docs/83465/vos618a.pdf)

Pads: 4
SMD: 8.4×3.1
Boards: 2

SSOP-44_5.3x12.8mm_P0.5mm

FP3D

Package_SO

44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)

Pads: 44
SMD: 8.5×13.3
Boards: 2

Texas_DYY0016A_TSOT-23-16_2x4.2mm_P0.5mm

FP—

Package_SO

Texas DYY0016A TSSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tmux1574.pdf#page=42)

Pads: 16
SMD: 4.6×4.7
Boards: 2

Texas_PWP0020A

FP3D

Package_SO

20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)

Pads: 21
SMD: 8.2×7.0
Boards: 2