Footprints

1,673 footprints matching “J”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,673 footprints · page 68 of 70

Matched by name and keywords. Search by meaning instead

RJ45_DS1126_Connfly

FP—

muratovas-MAS_Package_std

1 port ethernet through hole connector, https://www.connfly.com/static/upload/file//DS1126.pdf

Pads: 9
THT: 19.6×19.6
Boards: —

RJ45_DS1128-09-S8B8X

FP—

muratovas-MAS_Package_std

RJ45 8-pin port with LED

Pads: 14
THT: 19.1×16.3
Boards: —

SMA_Amphenol_901-143_Horizontal

FP—

muratovas-MAS_Package_std

Amphenol RF 901-143 https://www.amphenolrf.com/library/download/link/link_id/585682

Pads: 2
THT: 8.6×16.3
Boards: —

Siemens_SFH900

FP3D

OptoDevice

package for Siemens SFH900 reflex photo interrupter/coupler/object detector, see https://www.batronix.com/pdf/sfh900.pdf

Pads: 3
THT: 7.5×2.5
Boards: —

Oscillator_SMD_SeikoEpson_SG8002JA-4Pin_14.0x8.7mm

FP—

Oscillator

Seiko Epson SG-8002JA, Crystal Oscillator, 14.0x8.7mm package, SMD, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC

Pads: 4
SMD: 15.0×12.3
Boards: —

Oscillator_SMD_SeikoEpson_SG8002JA-4Pin_14.0x8.7mm_HandSoldering

FP—

Oscillator

Seiko Epson SG-8002JA, Crystal Oscillator, 14.0x8.7mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC

Pads: 4
SMD: 15.0×15.3
Boards: —

Oscillator_SMD_SeikoEpson_SG8002JC-4Pin_10.5x5.0mm

FP—

Oscillator

Seiko Epson SG-8002JC, Crystal Oscillator, 10.5x5.0mm package, SMD, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC

Pads: 4
SMD: 11.5×7.2
Boards: —

Oscillator_SMD_SeikoEpson_SG8002JC-4Pin_10.5x5.0mm_HandSoldering

FP—

Oscillator

Seiko Epson SG-8002JC, Crystal Oscillator, 10.5x5.0mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC

Pads: 4
SMD: 11.5×9.3
Boards: —

BGA-100_12x18mm_Layout10x17_P1mm

FP—

Package_BGA

BGA-100, 12x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 100
SMD: 14.0×20.0
Boards: —

BGA-100_14x18mm_Layout10x17_P1mm

FP—

Package_BGA

BGA-100, 14x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 100
SMD: 16.0×20.0
Boards: —

BGA-132_12x18mm_Layout11x17_P1mm

FP—

Package_BGA

BGA-132, 12x18mm, 132 Ball, 11x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 132
SMD: 14.0×20.0
Boards: —

BGA-152_14x18mm_Layout13x17_P1mm

FP—

Package_BGA

BGA-152, 14x18mm, 152 Ball, 13x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 152
SMD: 16.0×20.0
Boards: —

BGA-63_9x11mm_Layout10x12_P0.8mm

FP—

Package_BGA

BGA-63, 9.0x11.0mm, 63 Ball, 10x12 Layout, 0.8mm Pitch, https://www.jedec.org/system/files/docs/MO-207N.pdf

Pads: 63
SMD: 11.0×13.0
Boards: —

Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm

FP3D

Package_BGA

WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf

Pads: 8
SMD: 4.3×5.1
Boards: —

Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf

Pads: 113
SMD: 9.0×9.0
Boards: —

Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 12
SMD: 4.5×4.0
Boards: —

Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 80
SMD: 6.0×6.0
Boards: —

LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm

FP—

Package_CSP

LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)

Pads: 57
SMD: 9.3×9.3
Boards: —

LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias

FP—

Package_CSP

LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)

Pads: 57
SMD: 9.3×9.3
Boards: —

Diodes_UDFN-10_1x2.5mm_P0.5mm

FP3D

Package_DFN_QFN

Diodes UDFN, 10 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2510-10-Type-CJ.pdf)

Pads: 10
SMD: 1.9×3.0
Boards: —

Maxim_WSON-8-1EP_3x2mm_P0.5mm_EP1.75x1.63mm

FP3D

Package_DFN_QFN

Maxim WSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0174.pdf, https://www.analog.com/media/en/package-pcb-resources/land-pattern/tdfn-ep/90-0091.pdf)

Pads: 9
SMD: 4.1×2.5
Boards: —