Footprints
1,939 footprints matching “leaded”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
Fuse_BelFuse_0ZRE0100FF_L18.7mm_W5.1mm
Fuse
Fuse 0ZRE0100FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 19.2×5.6
- Boards
- 4
Fuseholder_Clip-6.3x32mm_Littelfuse_102_122_Inline_P34.21x7.62mm_D1.98mm_Horizontal
Fuse
Fuseholder Clips, 6.3x32mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 102/122 Straight Leads, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_102_122_datasheet.pdf.pdf
- Pads
- 2
- THT
- 37.7×8.4
- Boards
- 4
DFN-16-1EP_3x4mm_P0.45mm_EP1.7x3.3mm
Package_DFN_QFN
DE Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf)
- Pads
- 17
- SMD
- 4.1×4.6
- Boards
- 4
DFN-16-1EP_4x5mm_P0.5mm_EP2.44x4.34mm
Package_DFN_QFN
DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf)
- Pads
- 17
- SMD
- 5.0×5.6
- Boards
- 4
DFN-8-1EP_6x5mm_P1.27mm_EP4x4mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download)
- Pads
- 9
- SMD
- 7.4×5.7
- Boards
- 4
CERDIP-8_W7.62mm_SideBrazed
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 9.7×13.7
- Boards
- 4
CERDIP-8_W7.62mm_SideBrazed_LongPads
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 10.5×13.7
- Boards
- 4
CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 10.7×13.8
- Boards
- 4
DIP-10_W7.62mm_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 10
- THT
- 10.5×13.2
- Boards
- 4
DIP-12_W7.62mm
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 12
- THT
- 9.7×15.7
- Boards
- 4
DIP-48_W15.24mm_LongPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 48
- THT
- 18.1×61.5
- Boards
- 4
Vishay_HVM-DIP-3_W7.62mm
Package_DIP
3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf
- Pads
- 3
- THT
- 9.9×5.5
- Boards
- 4
Analog_LCC-8_5x5mm_P1.27mm
Package_LCC
LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf
- Pads
- 8
- SMD
- 6.3×6.4
- Boards
- 4
SO-6_4.4x3.6mm_P1.27mm
Package_SO
6-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 8.8×4.1
- Boards
- 4
SOIC-8-N7_3.9x4.9mm_P1.27mm
Package_SO
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)
- Pads
- 7
- SMD
- 7.5×5.4
- Boards
- 4
SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf
- Pads
- 8
- SMD
- 11.9×10.3
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.9×3.5
- Boards
- 4
TO-92_Inline_Horizontal1
Package_TO_SOT_THT
TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.1×10.1
- Boards
- 4
Fuse_BelFuse_0ZRE0055FF_L14.0mm_W4.1mm
Fuse
Fuse 0ZRE0055FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 14.5×4.6
- Boards
- 3
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.25x3.25mm
Package_CSP
32-Lead Frame Chip Scale Package LFCSP (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf
- Pads
- 33
- SMD
- 6.0×6.0
- Boards
- 3
DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 13
- SMD
- 4.3×3.6
- Boards
- 3
DFN-6_1.3x1.2mm_P0.4mm
Package_DFN_QFN
6-Lead Plastic DFN (1.3mm x 1.2mm)
- Pads
- 6
- SMD
- 1.6×1.4
- Boards
- 3