Footprints

251 footprints matching “dual”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

251 footprints · page 9 of 11

Matched by name and keywords. Search by meaning instead

ESP32-C5-WROOM-1U

FP—

espressif-Espressif

ESP32-C5-WROOM-1U: Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth ® 5 (LE), Zigbee, and Thread (802.15.4) Built around ESP32-C5 series of SoCs, 32-bit RISC-V single-core microprocessor Flash up to 32 MB Up to 22 GPIOs, rich set of peripherals

Pads: 32
SMD: 19.6×22.8
Boards: —

ESP32-S3-WROOM-1

FP—

espressif-Espressif

ESP32-S3-WROOM-1 is a powerful, generic Wi-Fi + Bluetooth LE MCU modules that have Dual core CPU , a rich set of peripherals, provides acceleration for neural network computing and signal processing workloads. They are an ideal choice for a wide variety of application scenarios related to AI + Internet of Things (AIoT), such as wake word detection and speech commands recognition , face detection and recognition, smart home, smart appliance, smart control panel, smart speaker etc.

Pads: 41
SMD: 19.6×26.6
Boards: —

ESP32-S3-WROOM-1U

FP—

espressif-Espressif

Pads: 41
SMD: 19.6×20.5
Boards: —

ESP32-S3-WROOM-2

FP—

espressif-Espressif

ESP32-S3-WROOM-2 is a powerful, generic Wi-Fi + Bluetooth LE MCU modules that have Dual core CPU , a rich set of peripherals, provides acceleration for neural network computing and signal processing workloads. They are an ideal choice for a wide variety of application scenarios related to AI + Internet of Things (AIoT), such as wake word detection and speech commands recognition , face detection and recognition, smart home, smart appliance, smart control panel, smart speaker etc.

Pads: 41
SMD: 19.6×26.6
Boards: —

ESP32-S31-WROOM-3

FP—

espressif-Espressif

Built-in ESP32-S31 series chip, featuring a RISC-V 32-bit dual-core microprocessor, suitable for embedded systems, smart home, wearable electronic devices, and other IoT scenarios

Pads: 99
SMD: 22.5×30.5
Boards: —

ESP32-WROOM-DA

FP—

espressif-Espressif

ESP32-WROOM-DA: https://www.espressif.com/sites/default/files/documentation/esp32-wroom-da_datasheet_en.pdf

Pads: 41
SMD: 37.0×36.0
Boards: —

Molex_CLIK-Mate_213227-32xx_2x16-1MP_P1.50mm_Vertical

FP—

gekkio-Gekkio_Connector_Molex

Molex CLIK-Mate dual row, 32 circuits, https://www.molex.com/pdm_docs/sd/2132273210_sd.pdf

Pads: 33
SMD: 30.4×12.9
Boards: —

L_Bourns_SRF0703

FP—

gekkio-Gekkio_Inductor_SMD

Dual-Winding Shielded Power Inductor, https://www.bourns.com/docs/Product-Datasheets/SRF0703.pdf

Pads: 4
SMD: 8.1×8.4
Boards: —

L_Eaton_DRQ73

FP—

gekkio-Gekkio_Inductor_SMD

Dual winding shielded drum core power inductor, https://www.eaton.com/content/dam/eaton/products/electronic-components/resources/data-sheet/eaton-drq-shielded-drum-core-power-inductors-data-sheet.pdf

Pads: 4
SMD: 8.0×8.0
Boards: —

L_Eaton_DRQ74

FP—

gekkio-Gekkio_Inductor_SMD

Dual winding shielded drum core power inductor, https://www.eaton.com/content/dam/eaton/products/electronic-components/resources/data-sheet/eaton-drq-shielded-drum-core-power-inductors-data-sheet.pdf

Pads: 4
SMD: 8.0×8.0
Boards: —

Lattice_QFN-84-1EP_7x7mm_P0.5mm_EP4.4x4.4mm

FP—

gekkio-Gekkio_Package_DFN_QFN

QFN, dual row, pins (http://www.latticesemi.com/view_document?document_id=44670)

Pads: 85
SMD: 7.5×7.5
Boards: —

Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 25.4mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531002B02500G_34.9x12.7mm_H25.4mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 25.4mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531102B00000G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 38.1mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: —
Mount: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531102B02100G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531102V02500G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, AavSHIELD3 finish, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531202B00000G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: —
Mount: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531202B02100G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531202B02500G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —

Heatsink_AAVID_Extruded_531302B02500G_34.9x12.7mm_H63.5mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 63.5mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads: 1
THT: 36.0×14.0
Boards: —