Footprints
292 footprints matching “3.9”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_3.9x4.9mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 3,516
SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-012, variation AC, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf)
- Pads
- 16
- SMD
- 7.4×10.4
- Boards
- 1,078
SOIC-14_3.9x8.7mm_P1.27mm
Package_SO
SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 908
SO-8_3.9x4.9mm_P1.27mm
Package_SO
SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 380
SO-14_3.9x8.65mm_P1.27mm
Package_SO
SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 147
SO-16_3.9x9.9mm_P1.27mm
Package_SO
SO, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf)
- Pads
- 16
- SMD
- 7.4×10.4
- Boards
- 141
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 135
TI_SO-PowerPAD-8_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 103
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
JST_VH_B2P-VH-B_1x02_P3.96mm_Vertical
Connector_JST
JST VH PBT series connector, B2P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)
- Pads
- 2
- THT
- 8.9×9.5
- Boards
- 46
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
JST_VH_B2P-VH_1x02_P3.96mm_Vertical
Connector_JST
JST VH series connector, B2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)
- Pads
- 2
- THT
- 8.9×9.5
- Boards
- 34
SSOP-8_3.9x5.05mm_P1.27mm
Package_SO
SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)
- Pads
- 8
- SMD
- 7.4×5.6
- Boards
- 34
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 34
Molex_KK-396_A-41791-0002_1x02_P3.96mm_Vertical
Connector_Molex
Molex KK 396 Interconnect System, old/engineering part number: A-41791-0002 example for new part number: 26-60-4020, 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf)
- Pads
- 2
- THT
- 8.8×11.0
- Boards
- 33
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- 33
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
RV_Disc_D12mm_W3.9mm_P7.5mm
Varistor
Varistor, diameter 12mm, width 3.9mm, pitch 7.5mm
- Pads
- 2
- THT
- 12.5×4.4
- Boards
- 30
SolderWire-2sqmm_1x01_D2mm_OD3.9mm
Connector_Wire
Soldered wire connection, for a single 2 mm² wire, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 5.4×4.9
- Boards
- 29