Footprints
21 footprints matching “5.9mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SSO-8_6.8x5.9mm_P1.27mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 13.1×6.4
- Boards
- 13
L_Toroid_Vertical_L31.8mm_W15.9mm_P13.50mm_Bourns_5700
Inductor_THT
L_Toroid, Vertical series, Radial, pin pitch=13.50mm, length*width=31.8*15.9mm^2, Bourns, 5700, http://www.bourns.com/docs/Product-Datasheets/5700_series.pdf
- Pads
- 2
- THT
- 32.3×17.6
- Boards
- 8
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8
QFN-56-1EP_8x8mm_P0.5mm_EP5.9x5.9mm
Package_DFN_QFN
QFN, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001734B.pdf#page=50)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- 4
RV_Disc_D15.5mm_W5.9mm_P7.5mm
Varistor
Varistor, diameter 15.5mm, width 5.9mm, pitch 7.5mm
- Pads
- 2
- THT
- 16.0×6.4
- Boards
- 4
SW_DIP_SPSTx02_Slide_Copal_CVS-02xB_W5.9mm_P1mm
Button_Switch_SMD
SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf)
- Pads
- 5
- SMD
- 7.6×4.3
- Boards
- 3
SW_DIP_SPSTx01_Slide_Copal_CVS-01xB_W5.9mm_P1mm
Button_Switch_SMD
SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf)
- Pads
- 3
- SMD
- 7.6×3.3
- Boards
- 2
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×16.6
- Boards
- 2
SW_DIP_SPSTx03_Slide_Copal_CVS-03xB_W5.9mm_P1mm
Button_Switch_SMD
SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf)
- Pads
- 7
- SMD
- 7.6×5.3
- Boards
- 1
QFN-56-1EP_8x8mm_P0.5mm_EP5.9x5.9mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001734B.pdf#page=50)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- 1
SSO-8_6.8x5.9mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 11.2×6.4
- Boards
- 1
SW_DIP_SPSTx04_Slide_Copal_CVS-04xB_W5.9mm_P1mm
Button_Switch_SMD
SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf)
- Pads
- 9
- SMD
- 7.6×6.3
- Boards
- —
SW_DIP_SPSTx08_Slide_Copal_CVS-08xB_W5.9mm_P1mm
Button_Switch_SMD
SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf)
- Pads
- 17
- SMD
- 7.6×10.3
- Boards
- —
CAP ALSMD ELEC 6.6MM H5.9MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 6.60mm Land Size, 6.30mm Diameter, 5.90mm Height, 8.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 10.1×7.0
- Boards
- —
JAE_MM60-EZH059-Bx_BUS_PCI_Express_Holder
Connector_PCBEdge
PCI Express mini card latch for 5.9mm connector height, https://www.jae.com/direct/topics/topics_file_download/topics_id=68910&ext_no=06&index=0&_lang=en&v=
- Pads
- 1
- SMD
- 30.0×9.4
- Boards
- —
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×18.2
- Boards
- —
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 20
- SMD
- 15.9×16.4
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×18.2
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×16.6
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
Texas_DKD0036A_HSSOP-36_11x15.9mm_P0.65mm_TopEP5.85x12.65mm
Package_SO
Texas DKD0036A HSSOP, 36 Pin (https://www.ti.com/lit/ml/pptd185d/pptd185d.pdf)
- Pads
- 36
- SMD
- 15.7×16.4
- Boards
- —