Footprints

60 footprints matching “HTSSOP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

60 footprints · page 1 of 3

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HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 31

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads: 57
SMD: 9.6×14.6
Boards: 16

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 13

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 10

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm

FP—

Package_SO

HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20)

Pads: 17
SMD: 7.8×5.5
Boards: 10

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

Pads: 17
SMD: 7.8×5.5
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 9

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 8

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: 6

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm

FP—

Package_SO

HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 21
SMD: 7.7×7.0
Boards: 4

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm

FP—

Package_SO

HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)

Pads: 25
SMD: 7.8×8.3
Boards: 4

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads: 21
SMD: 7.7×7.0
Boards: 2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2