Footprints

68 footprints matching “SOIC-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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68 footprints · page 1 of 3

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SOIC-8

FP3D

agg-agg

Pads: 8
SMD: 7.5×5.5
Boards: —

SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 3,516

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 135

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 38

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 28

SOIC-8_7.5x5.85mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)

Pads: 8
SMD: 13.0×6.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 11

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads: 8
SMD: 9.4×6.7
Boards: 8

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads: 9
SMD: 7.4×5.4
Boards: 8

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads: 9
SMD: 7.4×5.4
Boards: 7

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm

FP—

Package_SO

Pads: 9
SMD: 7.4×5.4
Boards: 4

SOIC-8-N7_3.9x4.9mm_P1.27mm

FP3D

Package_SO

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)

Pads: 7
SMD: 7.5×5.4
Boards: 4