Footprints
17 footprints matching “F”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm
Package_BGA
FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687
- Pads
- 78
- SMD
- 9.5×13.0
- Boards
- —
FCPBGA-780_23x23mm_Layout28x28_P0.8mm
Package_BGA
FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf
- Pads
- 780
- SMD
- 25.0×25.0
- Boards
- —
Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm
Package_BGA
WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf
- Pads
- 8
- SMD
- 4.3×5.1
- Boards
- —
TFBGA-100_8x8mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199
- Pads
- 100
- SMD
- 10.0×10.0
- Boards
- 8
TFBGA-100_9.0x9.0mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 10x10, 9x9mm package, pitch 0.8mm
- Pads
- 100
- SMD
- 11.0×11.0
- Boards
- 3
LFBGA-100_10x10mm_Layout10x10_P0.8mm
Package_BGA
LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87
- Pads
- 100
- SMD
- 12.0×12.0
- Boards
- 1
LFBGA-144_10x10mm_Layout12x12_P0.8mm
Package_BGA
LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114
- Pads
- 144
- SMD
- 12.0×12.0
- Boards
- 1
TFBGA-121_10x10mm_Layout11x11_P0.8mm
Package_BGA
TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495
- Pads
- 121
- SMD
- 12.0×12.0
- Boards
- 1
TFBGA-216_13x13mm_Layout15x15_P0.8mm
Package_BGA
TFBGA-216, 13.0x13.0mm, 216 Ball, 15x15 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=219
- Pads
- 216
- SMD
- 15.0×15.0
- Boards
- 1
TFBGA-265_14x14mm_Layout17x17_P0.8mm
Package_BGA
TFBGA-265, 14.0x14.0mm, 265 Ball, 17x17 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/DM00387108.pdf#page=223
- Pads
- 265
- SMD
- 16.0×16.0
- Boards
- 1
NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm
Package_BGA
NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf
- Pads
- 98
- SMD
- 9.0×9.0
- Boards
- —
NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm
Package_BGA
NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf
- Pads
- 59
- SMD
- 6.0×6.0
- Boards
- —
NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm
Package_BGA
NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf
- Pads
- 42
- SMD
- 4.6×5.0
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
TFBGA-64_5x5mm_Layout8x8_P0.5mm
Package_BGA
TFBGA-64, 5.0x5.0mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f100v8.pdf#page=83
- Pads
- 64
- SMD
- 7.0×7.0
- Boards
- —
TFBGA-644_19x19mm_Layout28x28_P0.65mm
Package_BGA
TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF
- Pads
- 644
- SMD
- 21.0×21.0
- Boards
- —