Footprints
29 footprints matching “11”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf
- Pads
- 169
- SMD
- 13.0×13.0
- Boards
- 2
BGA-100_11.0x11.0mm_Layout10x10_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-100, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00223-02.pdf
- Pads
- 100
- SMD
- 13.0×13.0
- Boards
- 1
Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm
Package_BGA
Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 5
- SMD
- 2.8×3.1
- Boards
- 1
TFBGA-121_10x10mm_Layout11x11_P0.8mm
Package_BGA
TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495
- Pads
- 121
- SMD
- 12.0×12.0
- Boards
- 1
Analog_BGA-165_11.9x16mm_Layout11x15_P1.0mm
Package_BGA
Analog BGA-165 (Reference LTC DWG#05-08-1605 Rev B), 11.9x16.0mm, 165 Ball, 11x15 Layout, 1.0mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081605_b_bga165.pdf
- Pads
- 165
- SMD
- 13.9×18.0
- Boards
- —
Analog_BGA-209_9.5x16mm_Layout11x19_P0.8mm
Package_BGA
Analog BGA-209 (Reference LTC DWG#05-08-1561 Rev B), 9.5x16.0mm, 209 Ball, 11x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081561_bga209.pdf
- Pads
- 209
- SMD
- 11.5×18.0
- Boards
- —
Analog_BGA-77_9x15mm_Layout7x11_P1.27mm
Package_BGA
Analog Devices BGA-77, 0.63mm pad, 9x15mm, 77 Ball, 7x11 Layout, 1.27mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081964_B_bga77.pdf
- Pads
- 77
- SMD
- 11.0×17.0
- Boards
- —
BGA-100_6.0x6.0mm_Layout11x11_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-100, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00345-01.pdf
- Pads
- 100
- SMD
- 8.0×8.0
- Boards
- —
BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm
Package_BGA
BGA-1156
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —
BGA-132_12x18mm_Layout11x17_P1.0mm
Package_BGA
BGA-132 11x17 12x18mm 1.0pitch
- Pads
- 132
- SMD
- 13.0×19.0
- Boards
- —
BGA-132_12x18mm_Layout11x17_P1mm
Package_BGA
BGA-132, 12x18mm, 132 Ball, 11x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 132
- SMD
- 14.0×20.0
- Boards
- —
BGA-256_11.0x11.0mm_Layout20x20_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-256, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00348-01.pdf
- Pads
- 256
- SMD
- 13.0×13.0
- Boards
- —
BGA-63_9x11mm_Layout10x12_P0.8mm
Package_BGA
BGA-63, 9.0x11.0mm, 63 Ball, 10x12 Layout, 0.8mm Pitch, https://www.jedec.org/system/files/docs/MO-207N.pdf
- Pads
- 63
- SMD
- 11.0×13.0
- Boards
- —
FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm
Package_BGA
FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687
- Pads
- 78
- SMD
- 9.5×13.0
- Boards
- —
LFBGA-153_11.5x13mm_Layout14x14_P0.5mm
Package_BGA
JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 153
- SMD
- 13.5×15.0
- Boards
- —
Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm
Package_BGA
FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 1152
- SMD
- 37.0×37.0
- Boards
- —
Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm
Package_BGA
FCSG325, 11.0x11.0mm, 325 Ball, 21x21 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 325
- SMD
- 13.0×13.0
- Boards
- —
Microchip_TFBGA-196_11x11mm_Layout14x14_P0.75mm_SMD
Package_BGA
TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956
- Pads
- 196
- SMD
- 13.0×13.0
- Boards
- —
ST_TFBGA-320_11x11mm_Layout21x21_P0.5mm
Package_BGA
ST TFBGA-320, 11.0x11.0mm, 320 Ball, 21x21 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp131c.pdf
- Pads
- 320
- SMD
- 13.0×13.0
- Boards
- —
ST_UFBGA-121_6x6mm_Layout11x11_P0.5mm
Package_BGA
ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf
- Pads
- 121
- SMD
- 8.0×8.0
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —
XBGA-121_10x10mm_Layout11x11_P0.8mm
Package_BGA
XBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf
- Pads
- 121
- SMD
- 12.0×12.0
- Boards
- —