Footprints

145 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

145 footprints · page 1 of 7

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BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 16.0×16.0
Boards: 23

BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm

FP3D

Package_BGA

BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf

Pads: 96
SMD: 11.0×15.0
Boards: 15

WLP-4_0.86x0.86mm_P0.4mm

FP3D

Package_BGA

WLP-4_0.86x0.86mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-0612.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891

Pads: 4
SMD: 2.9×2.9
Boards: 12

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads: 121
SMD: 11.0×11.0
Boards: 9

TFBGA-100_8x8mm_Layout10x10_P0.8mm

FP3D

Package_BGA

TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199

Pads: 100
SMD: 10.0×10.0
Boards: 8

Micron_FBGA-96_9x14mm_Layout9x16_P0.8mm

FP—

Package_BGA

FBGA-96, 9.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26

Pads: 96
SMD: 11.0×16.0
Boards: 4

Texas_DSBGA-9_1.62x1.58mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.62mmx1.58mm, area grid, NSMD, YZF0009 pad definition, 1.62x1.58mm, 9 Ball, 3x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg027n/mxbg027n.pdf

Pads: 9
SMD: 3.6×3.6
Boards: 4

Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf

Pads: 6
SMD: 3.0×3.5
Boards: 3

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 2.9×3.9
Boards: 3

Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 3.4×3.4
Boards: 3

TFBGA-100_9.0x9.0mm_Layout10x10_P0.8mm

FP3D

Package_BGA

TFBGA-100, 10x10, 9x9mm package, pitch 0.8mm

Pads: 100
SMD: 11.0×11.0
Boards: 3

WLP-4_0.83x0.83mm_P0.4mm

FP3D

Package_BGA

WLP-4_0.83x0.83mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-100107.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891

Pads: 4
SMD: 2.8×2.8
Boards: 3

Xilinx_CSG324

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268

Pads: 324
SMD: 17.0×17.0
Boards: 3

Xilinx_FGG484

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275

Pads: 484
SMD: 25.0×25.0
Boards: 3

BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf

Pads: 169
SMD: 13.0×13.0
Boards: 2

BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf

Pads: 324
SMD: 17.0×17.0
Boards: 2

Micron_FBGA-96_7.5x13.5mm_Layout9x16_P0.8mm

FP—

Package_BGA

FBGA-96, 7.5x13.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27

Pads: 96
SMD: 9.5×15.5
Boards: 2

Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf

Pads: 6
SMD: 1.9×2.3
Boards: 2

Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234

Pads: 8
SMD: 2.7×3.5
Boards: 2

Xilinx_CLG400

FP—

Package_BGA

Zynq-7000 BGA, NSMD pad definition Appendix A, 17x17mm, 400 Ball, 20x20 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78

Pads: 400
SMD: 19.0×19.0
Boards: 2

Xilinx_CSG325

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268

Pads: 324
SMD: 17.0×17.0
Boards: 2

Alliance_TFBGA-54_8x8mm_Layout9x9_P0.8mm

FP—

Package_BGA

Alliance TFBGA 54 pins, 8x8mm, 54 Ball, 9x9 Layout, 0.8mm Pitch, https://www.alliancememory.com/wp-content/uploads/pdf/dram/Alliance_Memory_64M-AS4C4M16SA-CI_v5.0_October_2018.pdf#page=54

Pads: 54
SMD: 10.0×10.0
Boards: 1