Footprints
62 footprints matching “8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm
Package_CSP
LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 3
LFCSP-8-1EP_3x3mm_P0.5mm_EP1.45x1.74mm
Package_CSP
LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
LFCSP-8-1EP_3x3mm_P0.5mm_EP1.6x2.34mm
Package_CSP
LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
LFCSP-8-1EP_3x3mm_P0.5mm_EP1.6x2.34mm_ThermalVias
Package_CSP
LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 2
LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm
Package_CSP
LFCSP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_48_5.pdf)
- Pads
- 49
- SMD
- 8.2×8.2
- Boards
- 1
LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias
Package_CSP
LFCSP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_48_5.pdf)
- Pads
- 49
- SMD
- 8.2×8.2
- Boards
- 1
Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm
Package_CSP
LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)
- Pads
- 5
- SMD
- 4.0×3.5
- Boards
- —
Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm
Package_CSP
Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9
- Pads
- 64
- SMD
- 5.5×5.4
- Boards
- —
Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm
Package_CSP
WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 80
- SMD
- 6.5×5.6
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm
Package_CSP
16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm_ThermalVias
Package_CSP
LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-8_2x2mm_P0.5mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf
- Pads
- 8
- SMD
- 2.8×2.6
- Boards
- —
LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf
- Pads
- 9
- SMD
- 3.8×2.6
- Boards
- —
LFCSP-VQ-48-1EP_7x7mm_P0.5mm
Package_CSP
LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html)
- Pads
- 49
- SMD
- 8.1×8.1
- Boards
- —
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm
Package_CSP
WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF
- Pads
- 35
- SMD
- 5.0×4.2
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —