Footprints
14 footprints matching “8mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 2
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm
Package_CSP
WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF
- Pads
- 35
- SMD
- 5.0×4.2
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
pSemi_CSP-16_1.64x2.04mm_P0.4mm_Pad0.18mm
Package_CSP
pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)
- Pads
- 16
- SMD
- 2.1×2.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-25_2.3x2.48mm_Layout5x5_P0.4mm
Package_CSP
ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf
- Pads
- 25
- SMD
- 4.3×4.5
- Boards
- —
ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197
- Pads
- 39
- SMD
- 4.8×4.8
- Boards
- —
ST_WLCSP-49_3.3x3.38mm_Layout7x7_P0.4mm_Offcenter
Package_CSP
ST WLCSP-49, off-center ball grid, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119
- Pads
- 49
- SMD
- 5.3×5.4
- Boards
- —
ST_WLCSP-56_3.38x3.38mm_Layout14x8_P0.4mm_Stagger
Package_CSP
ST WLCSP-56, ST die ID 455, 3.38x3.38mm, 56 Ball, X-staggered 14x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf
- Pads
- 56
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-72_3.38x3.38mm_Layout16x9_P0.35mm_Stagger
Package_CSP
ST WLCSP-72, ST die ID 455, 3.38x3.38mm, 72 Ball, X-staggered 16x9 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf
- Pads
- 72
- SMD
- 5.4×5.4
- Boards
- —
Xilinx_CSG48_7.0x7.0mm_Layout7x7_P0.8mm
Package_CSP
XC9572XL CS BGA, 7x7mm, 48 Ball, 7x7 Layout, 0.8mm Pitch, https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/cs48.pdf
- Pads
- 48
- SMD
- 9.0×9.0
- Boards
- —