Footprints

22 footprints matching “P1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

22 footprints

Matched by name and keywords. Search by meaning instead

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.5x1.5mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_27.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 2

LFCSP-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_CSP

LFCSP, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-6/cp_6_3.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 2

LFCSP-8-1EP_3x3mm_P0.5mm_EP1.45x1.74mm

FP3D

Package_CSP

LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 2

LFCSP-8-1EP_3x3mm_P0.5mm_EP1.6x2.34mm

FP—

Package_CSP

LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 2

LFCSP-8-1EP_3x3mm_P0.5mm_EP1.6x2.34mm_ThermalVias

FP—

Package_CSP

LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 2

LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm

FP3D

Package_CSP

LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)

Pads: 11
SMD: 4.3×3.5
Boards: 2

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 1

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 1

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 1

Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm

FP—

Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads: 5
SMD: 4.0×3.5
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm

FP—

Package_CSP

16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)

Pads: 17
SMD: 4.2×4.2
Boards: —

LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm

FP—

Package_CSP

LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf

Pads: 9
SMD: 3.8×2.6
Boards: —

LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias

FP3D

Package_CSP

LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)

Pads: 11
SMD: 4.3×3.5
Boards: —

LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm

FP—

Package_CSP

LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: —

LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias

FP—

Package_CSP

LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —