Footprints

6 footprints matching “chip”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

6 footprints

Matched by name and keywords. Search by meaning instead

LFCSP-32-1EP_5x5mm_P0.5mm_EP3.25x3.25mm

FP—

Package_CSP

32-Lead Frame Chip Scale Package LFCSP (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf

Pads: 33
SMD: 6.0×6.0
Boards: 3

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm

FP—

Package_CSP

16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)

Pads: 17
SMD: 4.2×4.2
Boards: —

LFCSP-72-1EP_10x10mm_P0.5mm_EP6.15x6.15mm

FP—

Package_CSP

72-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf)

Pads: 73
SMD: 10.9×10.9
Boards: —

Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm

FP—

Package_CSP

Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf

Pads: 15
SMD: 4.4×3.2
Boards: —

WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

FP3D

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

Pads: 6
SMD: 3.5×3.1
Boards: —

WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMD

FP—

Package_CSP

WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf

Pads: 8
SMD: 3.6×3.7
Boards: —