Footprints
14 footprints matching “pads”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm
Package_CSP
LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)
- Pads
- 5
- SMD
- 4.0×3.5
- Boards
- —
Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm
Package_CSP
Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9
- Pads
- 64
- SMD
- 5.5×5.4
- Boards
- —
Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm
Package_CSP
WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 80
- SMD
- 6.5×5.6
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm
Package_CSP
16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_CSP
LFCSP, 16 pin, 4x4mm, 2.1mm sq pad (http://www.analog.com/media/en/technical-documentation/data-sheets/ADG633.pdf)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf
- Pads
- 9
- SMD
- 3.8×2.6
- Boards
- —
LFCSP-VQ-24-1EP_4x4mm_P0.5mm_EP2.642x2.642mm
Package_CSP
LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf)
- Pads
- 25
- SMD
- 5.1×5.1
- Boards
- —
LFCSP-VQ-48-1EP_7x7mm_P0.5mm
Package_CSP
LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html)
- Pads
- 49
- SMD
- 8.1×8.1
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —