Footprints
43 footprints matching “x1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WLCSP-12_1.56x1.56mm_P0.4mm
Package_CSP
WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf
- Pads
- 12
- SMD
- 2.1×2.1
- Boards
- 9
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.5x1.5mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_27.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
LFCSP-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_CSP
LFCSP, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-6/cp_6_3.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 2
LFCSP-8-1EP_3x3mm_P0.5mm_EP1.45x1.74mm
Package_CSP
LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
WLCSP-6_1.4x1.0mm_P0.4mm
Package_CSP
6pin Pitch 0.4mm
- Pads
- 6
- SMD
- 1.9×1.5
- Boards
- 2
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm
Package_CSP
LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)
- Pads
- 73
- SMD
- 11.3×11.3
- Boards
- 1
Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm
Package_CSP
LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)
- Pads
- 5
- SMD
- 4.0×3.5
- Boards
- —
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm
Package_CSP
Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet
- Pads
- 34
- SMD
- 6.5×3.7
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm
Package_CSP
16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm_ThermalVias
Package_CSP
LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)
- Pads
- 73
- SMD
- 11.3×11.3
- Boards
- —
LFCSP-72-1EP_10x10mm_P0.5mm_EP6.15x6.15mm
Package_CSP
72-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf)
- Pads
- 73
- SMD
- 10.9×10.9
- Boards
- —
LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf
- Pads
- 9
- SMD
- 3.8×2.6
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm
Package_CSP
ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf
- Pads
- 100
- SMD
- 6.4×6.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-101_3.86x3.79mm_Layout11x19_P0.35mm_Stagger
Package_CSP
ST WLCSP-101, ST Die ID 485, 3.86x3.79mm, 101 Ball, Y-staggered 11x19 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7r3v8.pdf
- Pads
- 101
- SMD
- 5.9×5.8
- Boards
- —