Footprints

281 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

281 footprints · page 5 of 12

DIP-12_W7.62mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 12
THT: 10.5×15.7
Boards: 3

DIP-4_W10.16mm_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 4
THT: 13.1×5.6
Boards: 3

DIP-4_W7.62mm_Socket_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 4
THT: 10.7×5.7
Boards: 3

DIP-8-N7_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7

Pads: 7
THT: 9.8×10.7
Boards: 3

PowerIntegrations_SMD-8

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 8
SMD: 11.1×10.7
Boards: 3

CERDIP-14_W7.62mm_SideBrazed

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 9.7×19.6
Boards: 2

CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.7×19.7
Boards: 2

DIP-14_W10.16mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 14
THT: 13.1×18.3
Boards: 2

DIP-14_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 14
SMD: 12.5×18.4
Boards: 2

DIP-24_W10.16mm_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 24
THT: 13.1×31.0
Boards: 2

DIP-28_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 28
SMD: 10.7×36.2
Boards: 2

DIP-64_W22.86mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads

Pads: 64
THT: 25.8×81.8
Boards: 2

DIP-64_W25.4mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)

Pads: 64
THT: 27.5×81.8
Boards: 2

DIP-64_W25.4mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads

Pads: 64
THT: 28.4×81.9
Boards: 2

DIP-8-16_W7.62mm

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×20.8
Boards: 2

PowerIntegrations_SMD-8B

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
SMD: 11.1×10.7
Boards: 2

SMDIP-8_W11.48mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads: 8
SMD: 14.0×10.7
Boards: 2

SMDIP-8_W9.53mm_Clearance8mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 8
SMD: 11.5×10.7
Boards: 2

CERDIP-14_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.5×19.6
Boards: 1

CERDIP-16_W7.62mm_SideBrazed

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 9.7×20.8
Boards: 1

CERDIP-16_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.7×20.9
Boards: 1

CERDIP-18_W7.62mm_SideBrazed

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 9.7×23.4
Boards: 1

CERDIP-20_W7.62mm_SideBrazed

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 9.7×25.9
Boards: 1

CERDIP-20_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.5×25.9
Boards: 1