Footprints

397 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

397 footprints · page 8 of 17

SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm

FP—

Package_SO

SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)

Pads: 21
SMD: 11.9×13.3
Boards: 3

SOP-18_7.495x11.515mm_P1.27mm

FP—

Package_SO

SOP, 18 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523)

Pads: 18
SMD: 11.9×12.0
Boards: 3

SOP-8_6.605x9.655mm_P2.54mm

FP3D

Package_SO

SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)

Pads: 8
SMD: 11.5×10.2
Boards: 3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads: 18
SMD: 6.9×7.0
Boards: 3

SSOP-48_5.3x12.8mm_P0.5mm

FP—

Package_SO

SSOP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/05081887_A_G48.pdf)

Pads: 48
SMD: 9.4×13.3
Boards: 3

Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm

FP—

Package_SO

HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 3

Texas_S-PDSO-G8_3x3mm_P0.65mm

FP—

Package_SO

plastic small outline, https://www.ti.com/lit/ml/mpds028d/mpds028d.pdf, https://www.ti.com/lit/ds/symlink/dac8552.pdf#page=23

Pads: 8
SMD: 6.4×3.5
Boards: 3

TSOP-I-32_14.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB)

Pads: 32
SMD: 17.5×8.5
Boards: 3

TSOP-I-32_18.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD)

Pads: 32
SMD: 21.5×8.5
Boards: 3

TSOP-I-56_18.4x14mm_P0.5mm

FP3D

Package_SO

TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC)

Pads: 56
SMD: 21.5×14.5
Boards: 3

TSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm_ThermalVias

FP—

Package_SO

TSSOP, 16 Pin (Allegro A4954 https://www.allegromicro.com/-/media/Files/Datasheets/A4954-Datasheet.ashx)

Pads: 17
SMD: 7.8×5.5
Boards: 3

TSSOP-30_4.4x7.8mm_P0.5mm

FP3D

Package_SO

TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 30
SMD: 7.7×8.3
Boards: 3

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×16.6
Boards: 2

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm_ThermalVias

FP—

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 2

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads: 21
SMD: 7.7×7.0
Boards: 2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2