Footprints
55 footprints matching “1x”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
TSSOP-48_6.1x12.5mm_P0.5mm
Package_SO
TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 48
- SMD
- 9.4×13.0
- Boards
- 36
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- 33
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 25
SSOP-8_3.95x5.21x3.27mm_P1.27mm
Package_SO
SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm
- Pads
- 8
- SMD
- 7.2×5.7
- Boards
- 22
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 11
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
TSSOP-24_6.1x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 9.4×8.3
- Boards
- 7
SO-4_7.6x3.6mm_P2.54mm
Package_SO
SO, 4 Pin (https://everlightamericas.com/index.php?controller=attachment&id_attachment=3535)
- Pads
- 4
- SMD
- 11.7×4.1
- Boards
- 5
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 4
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 3
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 2
TSSOP-28_6.1x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 9.4×10.2
- Boards
- 2
TSSOP-56_6.1x14mm_P0.5mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 9.4×14.5
- Boards
- 2
Analog_MSOP-12-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm
Package_SO
Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081871_d_mse16(12).pdf https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 13
- SMD
- 5.6×4.5
- Boards
- 1
Analog_MSOP-12-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm_ThermalVias
Package_SO
Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081871_d_mse16(12).pdf https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 13
- SMD
- 5.6×4.5
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm_ThermalVias
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1