Footprints

45 footprints matching “20”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

45 footprints · page 1 of 2

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TSSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 20
SMD: 7.7×7.0
Boards: 731

SOIC-20W_7.5x12.8mm_P1.27mm

FP3D

Package_SO

SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)

Pads: 20
SMD: 11.9×13.3
Boards: 279

SSOP-20_5.3x7.2mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (JEDEC MO-150 variation AE, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=396)

Pads: 20
SMD: 9.4×7.7
Boards: 77

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

SO-20_12.8x7.5mm_P1.27mm

FP3D

Package_SO

SO-20, 12.8x7.5mm, https://www.nxp.com/docs/en/data-sheet/SA605.pdf

Pads: 20
SMD: 11.4×13.4
Boards: 48

SSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)

Pads: 20
SMD: 7.8×7.0
Boards: 39

SO-20_5.3x12.6mm_P1.27mm

FP—

Package_SO

SO, 20 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads: 20
SMD: 9.4×13.1
Boards: 35

SOP-20_7.5x12.8mm_P1.27mm

FP—

Package_SO

SOP, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf)

Pads: 20
SMD: 11.6×13.3
Boards: 13

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: 6

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm

FP—

Package_SO

HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 21
SMD: 7.7×7.0
Boards: 4

SOIC-20W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 20 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf)

Pads: 20
SMD: 11.8×15.9
Boards: 4

QSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

QSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 20
SMD: 7.4×9.2
Boards: 3

SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm

FP—

Package_SO

SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)

Pads: 21
SMD: 11.9×13.3
Boards: 3

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×16.6
Boards: 2

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads: 21
SMD: 7.7×7.0
Boards: 2

SOP-32_11.305x20.495mm_P1.27mm

FP—

Package_SO

SOP, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)

Pads: 32
SMD: 15.7×21.0
Boards: 2

Texas_PWP0020A

FP3D

Package_SO

20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)

Pads: 21
SMD: 8.2×7.0
Boards: 2