Footprints
20 footprints matching “36”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 2
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×18.2
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×16.6
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
Infineon_SOIC-20W_7.6x12.8mm_P1.27mm
Package_SO
Infineon SOIC, 20 Pin (https://www.infineon.com/dgdl/Infineon-PG-DSO-20-77_SPO_PDF-Package-v15_00-EN.pdf?fileId=5546d4625c54d85b015c627e1a0c23b3, https://www.infineon.com/dgdl/Infineon-PG-DSO-20-77_FPD_PDF-Footprint-v15_00-EN.pdf?fileId=5546d4625c54d85b015c5f0f49614324)
- Pads
- 20
- SMD
- 11.9×13.3
- Boards
- —
SOJ-36_10.16x23.495mm_P1.27mm
Package_SO
SOJ, 36 Pin (JEDEC MS-027-A, 400 mils width, variation AE, https://www.jedec.org/system/files/docs/Ms-027a.pdf)
- Pads
- 36
- SMD
- 12.6×24.0
- Boards
- —
ST_PowerSSO-36_SlugDown
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown_ThermalVias
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugUp
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 36
- SMD
- 12.1×10.8
- Boards
- —
Texas_DKD0036A_HSSOP-36_11x15.9mm_P0.65mm_TopEP5.85x12.65mm
Package_SO
Texas DKD0036A HSSOP, 36 Pin (https://www.ti.com/lit/ml/pptd185d/pptd185d.pdf)
- Pads
- 36
- SMD
- 15.7×16.4
- Boards
- —
TSSOP-36_4.4x7.8mm_P0.4mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var CC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 7.7×8.3
- Boards
- —
TSSOP-36_4.4x9.7mm_P0.5mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 7.7×10.2
- Boards
- —
TSSOP-36_6.1x12.5mm_P0.65mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 9.4×13.0
- Boards
- —
TSSOP-36_6.1x7.8mm_P0.4mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var FA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 9.4×8.3
- Boards
- —
TSSOP-36_6.1x9.7mm_P0.5mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 9.4×10.2
- Boards
- —
TSSOP-36_8x12.5mm_P0.65mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var GC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 11.3×13.0
- Boards
- —
TSSOP-36_8x9.7mm_P0.5mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var HA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 11.3×10.2
- Boards
- —