Footprints
26 footprints matching “width”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
SSOP-16_4.4x5.2mm_P0.65mm
Package_SO
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)
- Pads
- 16
- SMD
- 7.3×5.8
- Boards
- 22
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 8
SOIC-8_5.3x6.2mm_P1.27mm
Package_SO
SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)
- Pads
- 8
- SMD
- 9.4×6.7
- Boards
- 8
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
SOIC-32_7.518x20.777mm_P1.27mm
Package_SO
SOIC, 32 Pin (JEDEC MO-119-B, 300 mils width, variation AC, https://www.jedec.org/system/files/docs/Mo-119b.pdf)
- Pads
- 32
- SMD
- 11.9×21.3
- Boards
- 1
SOJ-28_10.16x18.415mm_P1.27mm
Package_SO
SOJ, 28 Pin (JEDEC MS-027-A, 400 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-027a.pdf)
- Pads
- 28
- SMD
- 12.6×18.9
- Boards
- 1
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
PSOP-44_16.9x27.17mm_P1.27mm
Package_SO
PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm
- Pads
- 44
- SMD
- 19.2×28.8
- Boards
- —
SOJ-24_7.62x15.875mm_P1.27mm
Package_SO
SOJ, 24 Pin (JEDEC MS-023-A, 300 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-023a.pdf)
- Pads
- 24
- SMD
- 9.8×16.4
- Boards
- —
SOJ-28_7.62x18.415mm_P1.27mm
Package_SO
SOJ, 28 Pin (JEDEC MS-023-A, 300 mils width, variation AD, https://www.jedec.org/system/files/docs/Ms-023a.pdf)
- Pads
- 28
- SMD
- 9.8×18.9
- Boards
- —
SOJ-32_10.16x20.955mm_P1.27mm
Package_SO
SOJ, 32 Pin (JEDEC MS-027-A, 400 mils width, variation AC, https://www.jedec.org/system/files/docs/Ms-027a.pdf)
- Pads
- 32
- SMD
- 12.6×21.5
- Boards
- —
SOJ-32_7.62x20.955mm_P1.27mm
Package_SO
SOJ, 32 Pin (JEDEC MS-023-A, 300 mils width, variation AE, https://www.jedec.org/system/files/docs/Ms-023a.pdf)
- Pads
- 32
- SMD
- 9.8×21.5
- Boards
- —