Footprints

21 footprints matching “Instruments”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints that come with a 3D model.

21 footprints

Matched by name and keywords. Search by meaning instead

Texas_DRT-3

FP3D

Package_TO_SOT_SMD

Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf

Pads: 3
SMD: 1.6×1.4
Boards: 39

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads: 8
SMD: 9.4×6.7
Boards: 8

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 2.9×3.9
Boards: 3

Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234

Pads: 8
SMD: 2.7×3.5
Boards: 2

Texas_PWP0020A

FP3D

Package_SO

20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)

Pads: 21
SMD: 8.2×7.0
Boards: 2

Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads: 12
SMD: 3.4×3.9
Boards: 1

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads: 21
SMD: 5.3×5.3
Boards: 1

Texas_X2QFN-8_1.5x1.5mm

FP3D

kiml-00-kiml-dfn-qfn

Texas Instruments RUG package, 1.5mm x 1.5mm QFN package, https://www.ti.com/lit/ds/symlink/tlv1701.pdf?ts=1647331616173&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FTLV1701

Pads: 8
SMD: 2.4×2.4
Boards: —

Texas_BGA-289_15x15mm_Layout17x17_P0.8mm

FP3D

Package_BGA

Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf

Pads: 289
SMD: 17.0×17.0
Boards: —

Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf

Pads: 10
SMD: 3.4×3.9
Boards: —

Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

Pads: 12
SMD: 4.1×3.6
Boards: —

Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads: 49
SMD: 5.3×5.5
Boards: —

Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm

FP3D

Package_BGA

Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf

Pads: 6
SMD: 2.8×3.0
Boards: —

Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf

Pads: 113
SMD: 9.0×9.0
Boards: —

Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 12
SMD: 4.5×4.0
Boards: —

Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 80
SMD: 6.0×6.0
Boards: —

Texas_S-PWQFN-N20

FP3D

Package_DFN_QFN

20-Pin Plastic Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf)

Pads: 20
SMD: 3.9×3.9
Boards: —

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

Pads: 21
SMD: 5.3×5.3
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 15
SMD: 7.8×5.5
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias

FP3D

Package_SO

Pads: 15
SMD: 7.8×5.5
Boards: —