Footprints

32 footprints matching “width”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

32 footprints · page 1 of 2

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SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33

SSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)

Pads: 24
SMD: 6.9×9.3
Boards: 30

SSOP-16_4.4x5.2mm_P0.65mm

FP3D

Package_SO

SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)

Pads: 16
SMD: 7.3×5.8
Boards: 22

Crystal_SMD_MicroCrystal_MS1V-T1K

FP3D

Crystal

MicroCrystal MS1V-T1K, Watch Crystal 6.1mm length 2.0mm diameter, length 6.1mm, width 2.0mm, SMD, https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/MS1V-T1K.pdf

Pads: 3
SMD: 4.0×9.1
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 8

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads: 8
SMD: 9.4×6.7
Boards: 8

SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads: 48
SMD: 11.1×16.5
Boards: 8

SSOP-56_7.5x18.5mm_P0.635mm

FP3D

Package_SO

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)

Pads: 56
SMD: 11.1×19.1
Boards: 5

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads: 18
SMD: 6.9×7.0
Boards: 3

Crystal_SMD_MicroCrystal_MS3V-T1R

FP—

Crystal

MicroCrystal MS3V-T1R, Watch Crystal 5.2mm length 1.4mm diameter, length 5.2mm, width 1.4mm, SMD, http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/MS3V-T1R.pdf

Pads: 3
SMD: 2.9×7.9
Boards: 2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2

TSSOP-44_4.4x11.2mm_P0.5mm

FP3D

Package_SO

TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)

Pads: 44
SMD: 7.4×11.9
Boards: 2

Crystal_SMD_FrontierElectronics_FM206

FP—

Crystal

Fronter Electronics FM206, Watch Crystal 6.0mm length 1.9mm diameter, length 6.0mm, width 1.9mm, SMD, http://www.chinafronter.com/wp-content/uploads/2013/12/FM206.pdf

Pads: 3
SMD: 4.0×9.6
Boards: 1

SOIC-32_7.518x20.777mm_P1.27mm

FP—

Package_SO

SOIC, 32 Pin (JEDEC MO-119-B, 300 mils width, variation AC, https://www.jedec.org/system/files/docs/Mo-119b.pdf)

Pads: 32
SMD: 11.9×21.3
Boards: 1

SOJ-28_10.16x18.415mm_P1.27mm

FP—

Package_SO

SOJ, 28 Pin (JEDEC MS-027-A, 400 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-027a.pdf)

Pads: 28
SMD: 12.6×18.9
Boards: 1

TSSOP-10_3x3mm_P0.5mm

FP—

jlcpcb-JLCPCB

TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf)

Pads: 10
SMD: 5.9×3.6
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads: 81
SMD: 17.4×17.4
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias

FP3D

Package_QFP

Pads: 81
SMD: 17.4×17.4
Boards: —