Footprints
3,408 footprints matching “3”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —
TFBGA-644_19x19mm_Layout28x28_P0.65mm
Package_BGA
TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF
- Pads
- 644
- SMD
- 21.0×21.0
- Boards
- —
UCBGA-36_2.5x2.5mm_Layout6x6_P0.4mm
Package_BGA
UCBGA-36, 2.5x2.5mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213
- Pads
- 36
- SMD
- 4.5×4.5
- Boards
- —
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.35x2.35mm
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_20.pdf, CP-16-20)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
LFCSP-16_3x3mm_P0.5mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf)
- Pads
- 16
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger
Package_CSP
ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101
- Pads
- 19
- SMD
- 3.7×4.5
- Boards
- —
ST_WLCSP-25_2.33x2.24mm_Layout5x5_P0.4mm
Package_CSP
ST WLCSP-25, ST Die ID 474, 2.33x2.24mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h503eb.pdf#page=155
- Pads
- 25
- SMD
- 4.3×4.2
- Boards
- —
ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger
Package_CSP
ST WLCSP-27, ST Die ID 459, 2.34x2.55mm, 27 Ball, X-staggered 9x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u031g6.pdf#page=105
- Pads
- 27
- SMD
- 4.3×4.6
- Boards
- —
ST_WLCSP-36_Die440
Package_CSP
WLCSP-36, 2.605x2.703mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f051t8.pdf#page=103
- Pads
- 36
- SMD
- 4.6×4.7
- Boards
- —
ST_WLCSP-36_Die458
Package_CSP
WLCSP-36, 2.553x2.579mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f410t8.pdf#page=130
- Pads
- 36
- SMD
- 4.6×4.6
- Boards
- —
ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197
- Pads
- 39
- SMD
- 4.8×4.8
- Boards
- —
WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm
Package_CSP
ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23
- Pads
- 6
- SMD
- 3.5×3.1
- Boards
- —
WLCSP-9_1.21x1.22mm_Layout3x3_P0.4mm
Package_CSP
WLCSP-9, 1.21x1.22mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/wlcspcb/cb_9_3.pdf
- Pads
- 9
- SMD
- 3.2×3.2
- Boards
- —
ArtInChip_QFN-68-1EP_7x7mm_P0.35mm_EP5.49x5.49mm_ThermalVias
Package_DFN_QFN
ArtInChip QFN, 68 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=42)
- Pads
- 69
- SMD
- 7.7×7.7
- Boards
- —
DFN-12-1EP_2x3mm_P0.45mm_EP0.64x2.4mm
Package_DFN_QFN
DDB Package; 12-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1723.pdf)
- Pads
- 13
- SMD
- 3.1×3.6
- Boards
- —
DFN-12-1EP_3x3mm_P0.45mm_EP1.65x2.38mm_ThermalVias
Package_DFN_QFN
DFN, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/DFN_12_05-08-1725.pdf)
- Pads
- 13
- SMD
- 4.3×3.5
- Boards
- —
DFN-12-1EP_4x4mm_P0.65mm_EP2.64x3.54mm
Package_DFN_QFN
DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF)
- Pads
- 13
- SMD
- 4.8×4.7
- Boards
- —
DFN-16-1EP_3x5mm_P0.5mm_EP1.66x4.4mm
Package_DFN_QFN
DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf)
- Pads
- 17
- SMD
- 4.0×5.6
- Boards
- —