Footprints

136 footprints matching “0.65”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

136 footprints · page 2 of 6

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TSSOP-16-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 25

SSOP-16_4.4x5.2mm_P0.65mm

FP3D

Package_SO

SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)

Pads: 16
SMD: 7.3×5.8
Boards: 22

PQFP-100_14x20mm_P0.65mm

FP3D

Package_QFP

PQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)

Pads: 100
SMD: 18.5×24.5
Boards: 18

VSON-8_3.3x3.3mm_P0.65mm_NexFET

FP3D

Package_SON

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf

Pads: 5
SMD: 4.0×3.8
Boards: 16

QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)

Pads: 17
SMD: 5.2×5.2
Boards: 15

SSOP-16_5.3x6.2mm_P0.65mm

FP3D

Package_SO

SSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14)

Pads: 16
SMD: 9.1×6.7
Boards: 15

QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)

Pads: 29
SMD: 7.3×7.3
Boards: 14

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads: 9
SMD: 6.3×3.5
Boards: 14

SSOP-14_5.3x6.2mm_P0.65mm

FP3D

Package_SO

SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)

Pads: 14
SMD: 9.4×6.7
Boards: 14

PQFP-160_28x28mm_P0.65mm

FP3D

Package_QFP

PQFP, 160 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)

Pads: 160
SMD: 32.5×32.5
Boards: 13

UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm

FP3D

Package_DFN_QFN

UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf

Pads: 5
SMD: 1.8×1.5
Boards: 12

Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)

Pads: 21
SMD: 6.3×6.3
Boards: 9

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9