Footprints
166 footprints matching “0.4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_Axial_L24.0mm_D7.1mm_P30.48mm_Horizontal_Vishay_IM-10-28
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=24*7.1mm^2, Vishay, IM-10-28, http://www.vishay.com/docs/34035/im10.pdf
- Pads
- 2
- THT
- 33.0×7.6
- Boards
- —
L_Axial_L26.0mm_D9.0mm_P30.48mm_Horizontal_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 33.4×9.5
- Boards
- —
L_CommonMode_Toroid_Vertical_L30.5mm_W15.2mm_Px10.16mm_Py20.32mm_Bourns_8100
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=10.16*20.32mm^2, length*width=30.479999999999997*15.239999999999998mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf
- Pads
- 4
- THT
- 31.0×15.7
- Boards
- —
L_CommonMode_Toroid_Vertical_L43.2mm_W22.9mm_Px17.78mm_Py30.48mm_Bourns_8100
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=17.78*30.48mm^2, length*width=43.18*22.86mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf
- Pads
- 4
- THT
- 43.7×23.4
- Boards
- —
TQFP-128_14x14mm_P0.4mm_PAD
muratovas-MAS_Package_std
TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF)
- Pads
- 129
- SMD
- 16.9×16.9
- Boards
- —
BGA-324_19.0x19.0mm_Layout18x18_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00233-03.pdf
- Pads
- 324
- SMD
- 21.0×21.0
- Boards
- —
BGA-81_4.496x4.377mm_Layout9x9_P0.4mm_Ball0.25mm_Pad0.2mm_NSMD
Package_BGA
Altera V81, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00478-01.pdf
- Pads
- 81
- SMD
- 6.5×6.4
- Boards
- —
Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm
Package_BGA
WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf
- Pads
- 8
- SMD
- 4.3×5.1
- Boards
- —
NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm
Package_BGA
NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf
- Pads
- 59
- SMD
- 6.0×6.0
- Boards
- —
NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm
Package_BGA
NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf
- Pads
- 42
- SMD
- 4.6×5.0
- Boards
- —
Texas_BGA-289_15x15mm_Layout17x17_P0.8mm
Package_BGA
Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf
- Pads
- 289
- SMD
- 17.0×17.0
- Boards
- —
Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 49
- SMD
- 5.3×5.5
- Boards
- —
UCBGA-36_2.5x2.5mm_Layout6x6_P0.4mm
Package_BGA
UCBGA-36, 2.5x2.5mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213
- Pads
- 36
- SMD
- 4.5×4.5
- Boards
- —
ucBGA-64_4x4mm_Layout8x8_P0.4mm
Package_BGA
ucBGA-64, 4x4mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213
- Pads
- 64
- SMD
- 6.0×6.0
- Boards
- —
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm
Package_CSP
Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf
- Pads
- 20
- SMD
- 3.7×4.1
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-20_1.94x2.4mm_Layout4x5_P0.4mm
Package_CSP
ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=105
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- —
ST_WLCSP-25_2.33x2.24mm_Layout5x5_P0.4mm
Package_CSP
ST WLCSP-25, ST Die ID 474, 2.33x2.24mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h503eb.pdf#page=155
- Pads
- 25
- SMD
- 4.3×4.2
- Boards
- —
ST_WLCSP-25_Die425
Package_CSP
WLCSP-25, 2.097x2.493mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l031f6.pdf#page=112
- Pads
- 25
- SMD
- 4.1×4.5
- Boards
- —
ST_WLCSP-25_Die444
Package_CSP
WLCSP-25, 2.423x2.325mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=93
- Pads
- 25
- SMD
- 4.4×4.3
- Boards
- —
ST_WLCSP-25_Die457
Package_CSP
WLCSP-25, 2.133x2.07mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l011k3.pdf#page=100
- Pads
- 25
- SMD
- 4.1×4.1
- Boards
- —
ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger
Package_CSP
ST WLCSP-27, ST Die ID 459, 2.34x2.55mm, 27 Ball, X-staggered 9x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u031g6.pdf#page=105
- Pads
- 27
- SMD
- 4.3×4.6
- Boards
- —
ST_WLCSP-36_Die440
Package_CSP
WLCSP-36, 2.605x2.703mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f051t8.pdf#page=103
- Pads
- 36
- SMD
- 4.6×4.7
- Boards
- —