Footprints

40 footprints matching “NXP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints that come with a 3D model.

40 footprints · page 1 of 2

Matched by name and keywords. Search by meaning instead

NXP_XSON-16

FP3D

Package_SON

http://www.nxp.com/documents/outline_drawing/SOT1341-1.pdf

Pads: 16
SMD: 3.3×3.7
Boards: 2

NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm

FP3D

Package_BGA

NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf

Pads: 98
SMD: 9.0×9.0
Boards: —

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

FP3D

Package_BGA

NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf

Pads: 59
SMD: 6.0×6.0
Boards: —

NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm

FP3D

Package_BGA

NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf

Pads: 42
SMD: 4.6×5.0
Boards: —

NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm

FP3D

Package_CSP

NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf

Pads: 49
SMD: 5.4×5.4
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —

TO-92_Inline

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 988

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

TO-92_Inline_Wide

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 7.1×4.7
Boards: 358

TO-92

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 181

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

TO-92_HandSolder

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×5.1
Boards: 117

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

SSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)

Pads: 16
SMD: 7.4×5.4
Boards: 98

TO-92_Wide

FP3D

Package_TO_SOT_THT

TO-92 leads molded, wide, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 7.1×5.6
Boards: 66

SSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)

Pads: 24
SMD: 6.9×9.3
Boards: 30

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27

SSOP-16_4.4x5.2mm_P0.65mm

FP3D

Package_SO

SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)

Pads: 16
SMD: 7.3×5.8
Boards: 22

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9