Footprints
69 footprints matching “Instruments”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 12
- SMD
- 3.4×3.9
- Boards
- 1
Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm
Package_BGA
Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 5
- SMD
- 2.8×3.1
- Boards
- 1
Texas_DSBGA-6_0.9x1.4mm_Layout2x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf)
- Pads
- 6
- SMD
- 2.9×3.4
- Boards
- 1
Texas_RQM0029A_VQFN-29_4x4mm_P0.4mm
Package_DFN_QFN
Texas RQM0029A VQFN, 29 Pin, https://www.ti.com/lit/ml/mpqf573/mpqf573.pdf
- Pads
- 29
- SMD
- 4.9×4.9
- Boards
- 1
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 1
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm_ThermalVias
Package_SO
TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- 1
Texas_X2QFN-8_1.5x1.5mm
kiml-00-kiml-dfn-qfn
Texas Instruments RUG package, 1.5mm x 1.5mm QFN package, https://www.ti.com/lit/ds/symlink/tlv1701.pdf?ts=1647331616173&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FTLV1701
- Pads
- 8
- SMD
- 2.4×2.4
- Boards
- —
Texas_EUS_R-PDSS-T5_THT
Module
Texas Instruments EUS 5 Pin Double Sided Module
- Pads
- 5
- THT
- 19.9×13.6
- Boards
- —
Texas_BGA-289_15x15mm_Layout17x17_P0.8mm
Package_BGA
Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf
- Pads
- 289
- SMD
- 17.0×17.0
- Boards
- —
Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf
- Pads
- 10
- SMD
- 3.4×3.9
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
Texas_DSBGA-16_2.39x2.39mm_Layout4x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf
- Pads
- 16
- SMD
- 4.4×4.4
- Boards
- —
Texas_DSBGA-28_1.9x3mm_Layout4x7_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 1.9x3.0mm, 28 Ball, 4x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 28
- SMD
- 3.9×5.0
- Boards
- —
Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 49
- SMD
- 5.3×5.5
- Boards
- —
Texas_DSBGA-5_0.8875x1.3875mm_Layout2x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf
- Pads
- 5
- SMD
- 2.9×3.4
- Boards
- —
Texas_DSBGA-5_1.5855x1.6365mm_Layout3x2_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YTA0005 pad definition, 1.5855x1.6365mm, 5 Ball, 3x2 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg263/mxbg263.pdf, https://www.ti.com/lit/ds/symlink/lm74.pdf#page=24
- Pads
- 5
- SMD
- 3.6×3.6
- Boards
- —
Texas_DSBGA-6_0.704x1.054mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA0006-C01 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62800.pdf
- Pads
- 6
- SMD
- 2.7×3.1
- Boards
- —
Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf
- Pads
- 6
- SMD
- 2.8×3.0
- Boards
- —
Texas_DSBGA-6_0.76x1.16mm_Layout2x3_P0.4mm
Package_BGA
Texas Instruments YFP0006, DSBGA-6, 0.76x1.16mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/ts5a12301e.pdf#page=23
- Pads
- 6
- SMD
- 2.8×3.2
- Boards
- —
Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelB
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf
- Pads
- 6
- SMD
- 2.9×3.3
- Boards
- —
Texas_DSBGA-64_3.415x3.535mm_Layout8x8_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 64
- SMD
- 5.4×5.5
- Boards
- —
Texas_DSBGA-8_1.5195x1.5195mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZR pad definition, 1.5195x1.5195mm, 8 Ball, 3x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf
- Pads
- 8
- SMD
- 3.5×3.5
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —