Footprints

1,509 footprints matching “2mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,509 footprints · page 24 of 63

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DFN-6-1EP_2x2mm_P0.5mm_EP0.6x1.37mm

FP—

Package_DFN_QFN

DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081703_C_DC6.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 1

DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.6mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP8904DD/document_id/1244/)

Pads: 9
SMD: 4.3×2.5
Boards: 1

Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm_ThermalVias

FP3D

Package_DFN_QFN

Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)

Pads: 9
SMD: 3.2×2.5
Boards: 1

QFN-64-1EP_9x9mm_P0.5mm_EP5.2x5.2mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 64 Pin (https://www.silabs.com/documents/public/data-sheets/Si5345-44-42-D-DataSheet.pdf#page=51)

Pads: 65
SMD: 10.2×10.2
Boards: 1

Texas_UQFN-10_1.5x2mm_P0.5mm

FP—

Package_DFN_QFN

Texas RSE0010A UQFN, 10 Pin (https://www.ti.com/lit/ml/mpqf186d/mpqf186d.pdf)

Pads: 10
SMD: 2.4×2.9
Boards: 1

VDFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.7mm

FP3D

Package_DFN_QFN

8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 3.2×2.6
Boards: 1

VQFN-100-1EP_12x12mm_P0.4mm_EP8x8mm

FP—

Package_DFN_QFN

VQFN, 100 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/UNG/ProductDocuments/DataSheets/USB7206C-Data-Sheet-DS00003850.pdf)

Pads: 101
SMD: 13.2×13.2
Boards: 1

WDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm

FP—

Package_DFN_QFN

WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf)

Pads: 9
SMD: 4.2×2.5
Boards: 1

CERDIP-14_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.5×19.6
Boards: 1

CERDIP-16_W7.62mm_SideBrazed

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 9.7×20.8
Boards: 1

CERDIP-16_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.7×20.9
Boards: 1

CERDIP-18_W7.62mm_SideBrazed

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 9.7×23.4
Boards: 1

CERDIP-20_W7.62mm_SideBrazed

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 9.7×25.9
Boards: 1

CERDIP-20_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.5×25.9
Boards: 1

CERDIP-20_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.7×26.0
Boards: 1

DIP-10_W7.62mm_Socket

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 10
THT: 10.7×13.3
Boards: 1

DIP-12_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 12
SMD: 10.7×15.9
Boards: 1

DIP-12_W7.62mm_Socket

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 12
THT: 10.7×15.9
Boards: 1

DIP-12_W7.62mm_Socket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 12
THT: 10.7×15.9
Boards: 1

DIP-22_W7.62mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 22
THT: 10.7×28.6
Boards: 1

DIP-5-6_W7.62mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils)

Pads: 5
THT: 9.8×8.2
Boards: 1

NXP_LGA-8_3x5mm_P1.25mm_H1.2mm

FP—

Package_LGA

NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf#page=15)

Pads: 8
SMD: 4.0×5.5
Boards: 1

TQFP-100_12x12mm_P0.4mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation ADE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=685)

Pads: 100
SMD: 15.3×15.3
Boards: 1

SIP4_Sharp-SSR_P7.62mm_Angled

FP3D

Package_SIP

SIP4 Footprint for SSR made by Sharp

Pads: 4
THT: 19.3×31.5
Boards: 1