Footprints
6,729 footprints matching “F”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm_ThermalVias
Package_CSP
LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
Package_CSP
LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm_ThermalVias
Package_CSP
LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-64-1EP_9x9mm_P0.5mm_EP5.21x5.21mm
Package_CSP
LFCSP, 64 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_64_7.pdf)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- —
LFCSP-64-1EP_9x9mm_P0.5mm_EP5.21x5.21mm_ThermalVias
Package_CSP
LFCSP, 64 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_64_7.pdf)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- —
LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm_ThermalVias
Package_CSP
LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)
- Pads
- 73
- SMD
- 11.3×11.3
- Boards
- —
LFCSP-72-1EP_10x10mm_P0.5mm_EP6.15x6.15mm
Package_CSP
72-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf)
- Pads
- 73
- SMD
- 10.9×10.9
- Boards
- —
LFCSP-8_2x2mm_P0.5mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf
- Pads
- 8
- SMD
- 2.8×2.6
- Boards
- —
LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf
- Pads
- 9
- SMD
- 3.8×2.6
- Boards
- —
LFCSP-VQ-24-1EP_4x4mm_P0.5mm_EP2.642x2.642mm
Package_CSP
LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf)
- Pads
- 25
- SMD
- 5.1×5.1
- Boards
- —
LFCSP-VQ-48-1EP_7x7mm_P0.5mm
Package_CSP
LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html)
- Pads
- 49
- SMD
- 8.1×8.1
- Boards
- —
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter
Package_CSP
ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55
- Pads
- 36
- SMD
- 4.7×4.6
- Boards
- —
ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter
Package_CSP
ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59
- Pads
- 36
- SMD
- 4.8×5.0
- Boards
- —
ST_WLCSP-36_Die458
Package_CSP
WLCSP-36, 2.553x2.579mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f410t8.pdf#page=130
- Pads
- 36
- SMD
- 4.6×4.6
- Boards
- —
ST_WLCSP-49_3.14x3.14mm_Layout7x7_P0.4mm_Offcenter
Package_CSP
ST WLCSP-49, ST Die ID 01E, 3.14x3.14mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb07cc.pdf#page=62
- Pads
- 49
- SMD
- 5.1×5.1
- Boards
- —
ST_WLCSP-49_3.3x3.38mm_Layout7x7_P0.4mm_Offcenter
Package_CSP
ST WLCSP-49, off-center ball grid, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119
- Pads
- 49
- SMD
- 5.3×5.4
- Boards
- —
ST_WLCSP-80_3.5x3.27mm_Layout10x16_P0.35mm_Stagger_Offcenter
Package_CSP
ST WLCSP-80, ST die ID 484, 3.5x3.27mm, 80 Ball, Y-staggered 10x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h563mi.pdf
- Pads
- 80
- SMD
- 5.5×5.3
- Boards
- —
WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm
Package_CSP
ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23
- Pads
- 6
- SMD
- 3.5×3.1
- Boards
- —