Footprints
476 footprints matching “0.4mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29)
- Pads
- 21
- SMD
- 4.3×4.3
- Boards
- 4
LQFP-64_7x7mm_P0.4mm
Package_QFP
LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT414-1.pdf)
- Pads
- 64
- SMD
- 10.4×10.4
- Boards
- 4
TQFP-128_14x14mm_P0.4mm
Package_QFP
TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 4
Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf
- Pads
- 6
- SMD
- 3.0×3.5
- Boards
- 3
WLP-4_0.83x0.83mm_P0.4mm
Package_BGA
WLP-4_0.83x0.83mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-100107.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891
- Pads
- 4
- SMD
- 2.8×2.8
- Boards
- 3
WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- 3
DFN-6_1.3x1.2mm_P0.4mm
Package_DFN_QFN
6-Lead Plastic DFN (1.3mm x 1.2mm)
- Pads
- 6
- SMD
- 1.6×1.4
- Boards
- 3
Nordic_AQFN-94-1EP_7x7mm_P0.4mm
Package_DFN_QFN
aQFN, Nordic, nRF5340, https://infocenter.nordicsemi.com/pdf/nRF5340_PS_v1.2.pdf
- Pads
- 95
- SMD
- 9.0×9.0
- Boards
- 3
QFN-24-1EP_3x4mm_P0.4mm_EP1.65x2.65mm
Package_DFN_QFN
QFN, 24 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)
- Pads
- 25
- SMD
- 4.3×5.3
- Boards
- 3
QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 3
QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 3
QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm_ThermalVias
Package_DFN_QFN
QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- 3
QFN-68-1EP_8x8mm_P0.4mm_EP6.4x6.4mm_ThermalVias
Package_DFN_QFN
QFN, 68 Pin (https://www.st.com/resource/en/datasheet/stm32h725ze.pdf)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- 3
QFN-76-1EP_9x9mm_P0.4mm_EP3.8x3.8mm
Package_DFN_QFN
QFN, 76 Pin (https://www.marvell.com/documents/bqcwxsoiqfjkcjdjhkvc/#page=19)
- Pads
- 77
- SMD
- 10.2×10.2
- Boards
- 3
QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm_ThermalVias
Package_DFN_QFN
QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)
- Pads
- 81
- SMD
- 11.2×11.2
- Boards
- 3
UQFN-10_1.3x1.8mm_P0.4mm
Package_DFN_QFN
UQFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9))
- Pads
- 10
- SMD
- 2.5×3.0
- Boards
- 3
LQFP-80_10x10mm_P0.4mm
Package_QFP
LQFP, 80 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/q80.10x10.pdf)
- Pads
- 80
- SMD
- 13.3×13.3
- Boards
- 3
SolderWire-0.1sqmm_1x04_P3.6mm_D0.4mm_OD1mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 13.4×8.6
- Boards
- 2
BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf
- Pads
- 169
- SMD
- 13.0×13.0
- Boards
- 2
BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
Maxim_WLP-9_1.595x1.415_Layout3x3_P0.4mm_Ball0.27mm_Pad0.25mm_NSMD
Package_BGA
Maxim_WLP-9 W91C1+1 https://pdfserv.maximintegrated.com/package_dwgs/21-0459.PDF
- Pads
- 9
- SMD
- 3.6×3.4
- Boards
- 2
Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf
- Pads
- 6
- SMD
- 1.9×2.3
- Boards
- 2
Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234
- Pads
- 8
- SMD
- 2.7×3.5
- Boards
- 2
WLCSP-6_1.4x1.0mm_P0.4mm
Package_CSP
6pin Pitch 0.4mm
- Pads
- 6
- SMD
- 1.9×1.5
- Boards
- 2