Footprints
434 footprints matching “0.65”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 9
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias
Package_SO
16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 9
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
SolderWire-0.25sqmm_1x02_P4.2mm_D0.65mm_OD1.7mm
Connector_Wire
Soldered wire connection, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 7.4×2.8
- Boards
- 8
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 8
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- 8
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 8
Broadcom_DFN-6_2x2mm_P0.65mm
OptoDevice
Broadcom DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN)
- Pads
- 6
- SMD
- 3.3×2.5
- Boards
- 7
TQFN-20-1EP_5x5mm_P0.65mm_EP3.25x3.25mm
Package_DFN_QFN
TQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-5))
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 7
ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 7
HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
Package_SO
HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 7
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 7
TSSOP-24_6.1x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 9.4×8.3
- Boards
- 7
Texas_DPY0002A_0.6x1mm_P0.65mm
Package_SON
X1SON 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf
- Pads
- 2
- SMD
- 1.3×0.9
- Boards
- 7
D_SOD-882D
Diode_SMD
SOD-882D, DFN1006D-2, body 1.0 x 0.6 x 0.4mm, pitch 0.65mm, https://assets.nexperia.com/documents/package-information/SOD882D.pdf
- Pads
- 2
- SMD
- 1.8×1.2
- Boards
- 6
QFN-16-1EP_4x4mm_P0.65mm_EP2.15x2.15mm
Package_DFN_QFN
QFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 6
QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 6
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 6
SolderWire-0.25sqmm_1x02_P4.2mm_D0.65mm_OD1.7mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 7.4×13.2
- Boards
- 5
QFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (https://www.allegromicro.com/~/media/Files/Datasheets/A4403-Datasheet.ashx)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 5
QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)
- Pads
- 29
- SMD
- 7.2×7.2
- Boards
- 5
Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 5