Footprints
512 footprints matching “SO-8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DFN-8-1EP_6x5mm_P1.27mm_EP4x4mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download)
- Pads
- 9
- SMD
- 7.4×5.7
- Boards
- 4
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
Package_DFN_QFN
Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 4
TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm
Package_DFN_QFN
TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35)
- Pads
- 9
- SMD
- 4.2×2.5
- Boards
- 4
CERDIP-8_W7.62mm_SideBrazed
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 9.7×13.7
- Boards
- 4
CERDIP-8_W7.62mm_SideBrazed_LongPads
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 10.5×13.7
- Boards
- 4
CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 10.7×13.8
- Boards
- 4
Analog_LCC-8_5x5mm_P1.27mm
Package_LCC
LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf
- Pads
- 8
- SMD
- 6.3×6.4
- Boards
- 4
AMS_OLGA-8_2x3.1mm_P0.8mm
Package_LGA
AMS OLGA, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63)
- Pads
- 8
- SMD
- 2.5×3.6
- Boards
- 4
SIP-8_19x3mm_P2.54mm
Package_SIP
SIP 8-pin (http://www.njr.com/semicon/PDF/package/SIP8_E.pdf)
- Pads
- 8
- THT
- 19.7×3.5
- Boards
- 4
PowerPAK_SO-8L_Single
Package_SO
PowerPAK SO-8L Single (https://www.vishay.com/docs/64721/an913.pdf)
- Pads
- 5
- SMD
- 7.8×6.8
- Boards
- 4
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 4
SOIC-8-N7_3.9x4.9mm_P1.27mm
Package_SO
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)
- Pads
- 7
- SMD
- 7.5×5.4
- Boards
- 4
SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf
- Pads
- 8
- SMD
- 11.9×10.3
- Boards
- 4
WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.9×3.5
- Boards
- 4
TSOT-23-8_HandSoldering
Package_TO_SOT_SMD
8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf
- Pads
- 8
- SMD
- 5.9×3.4
- Boards
- 4
Hirose_DF13C_CL535-0404-8-51_1x04-1MP_P1.25mm_Vertical
Connector_Hirose
Hirose DF13C SMD, CL535-0404-8-51, 4 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/)
- Pads
- 5
- SMD
- 10.9×6.3
- Boards
- 3
Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 2.9×3.9
- Boards
- 3
Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 3.4×3.4
- Boards
- 3
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16)
- Pads
- 9
- SMD
- 3.3×2.5
- Boards
- 3
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias
Package_DFN_QFN
http://ww1.microchip.com/downloads/en/DeviceDoc/mic2290.pdf
- Pads
- 9
- SMD
- 2.7×2.5
- Boards
- 3
MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm
Package_DFN_QFN
8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)
- Pads
- 9
- SMD
- 3.7×3.5
- Boards
- 3
WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 3
CERDIP-8_W7.62mm_SideBrazed_Socket
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 10.7×13.8
- Boards
- 3
DIP-8-N7_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- 3